50 Years of Smart Automation: SEHO Driving the Future of Through-Hole Soldering
As SEHO marks 50 years of quality made in Germany, the company continues to invest heavily in the future of through-hole soldering technology. For five decades, the SEHO has engineered selective soldering solutions that set the benchmark for reliability. However, the milestone isn’t simply a celebration of longevity; it marks a profound shift in how electronics manufacturing operates. Today, selective soldering has evolved from a purely machine-focused mechanical process into automated soldering technology driven by software guidance, digital twins, and real-time inspection feedback.
For facilities that have already moved from manual constraints, the challenge is no longer about transitioning to basic automation. It is about maximising process optimisation, eliminating new product introduction (NPI) defects, and extracting the highest possible throughput from every square meter of floor space.
Why Digital Transformation Matters in THT Right Now
In mixed-technology PCB manufacturing, production managers face escalating demands. The modern line expects faster setup times, total process visibility, and complete confidence before the first physical board ever passes through the fluxer. Engineers can no longer afford to rely on traditional, manual “trial-and-error” machine programming (Figure 1), which ties up valuable production assets and introduces unnecessary risk.
This is where digital process control becomes a critical asset rather than a futuristic luxury. By utilising a virtual replica of the production environment, manufacturers can simulate thermal profiles, analyse complex component geometries, and optimise machine trajectories entirely offline. The goal is to ensure a perfect, repeatable solder joint on the first run, without risking damage to high-value assemblies.
PICTURE
Solder Copilot: The Intelligent Layer Across Advanced Platforms
Developed with Deeptronics Gmbh to bring Industry 4.0 digitalisation to the factory floor, SEHOās Solder Copilot acts as the intelligent digital twin for your miniwave through-hole soldering processes. Rather than being restricted to a single flagship model, this software layer is designed to integrate across SEHOās platforms, including the entry-level StartSelective, and the advanced SelectLine-C, and PowerSelective lines.
The software uses Gerber data and PCB stack-up information to automatically calculate optimal solder dwell times (Figure 2) and precise thermal requirements based on copper weight. Key capabilities include:
Predictive Risk Identification: The software highlights “risk joints”, such as those with high thermal mass or dense surrounding components, suggesting exact parameter adjustments to guarantee vertical barrel fill without damaging surrounding components.
Path Optimisation: Solder Copilot automatically calculates the fastest, most efficient travel path for the solder nozzle, shaving valuable seconds off the overall cycle time.
Defect Reduction: By validating the program in a virtual environment, machine downtime for new product introductions (NPI) can be slashed by up to 50%.
While Solder Copilot provides immediate value on simpler lines, its predictive power becomes indispensable as board complexities and machine capabilities increase.
For mid-range, high-mix production environments, the SelectLine-C represents a breakthrough in how selective soldering systems are built and delivered. Traditionally, custom-engineered selective systems come with a 20+ week lead time. By standardising high-performance modules rather than building a fully custom-engineered system from scratch, SEHO has dramatically lowered the financial barrier to entry for tier-one selective soldering and cut down delivery times.
Despite the cost-conscious approach, the SelectLine-C is built purely for throughput maximisation:
Synchro Mode & SmartSplit: This patented software control allows the machine to handle up to four boards concurrently within a single machine footprint. It enables the simultaneous soldering of two boards (Figure 3) while a third is being fluxed and a fourth preheats, effectively cutting cycle times in half.
Advanced Nozzle Maintenance: Features an automatic ultrasonic nozzle cleaning system. Instead of operators manually scrubbing nozzles with chemicals, the system uses localised ultrasonic vibrations to restore the nozzle to a perfectly wetted state, ensuring the absolute wave stability required for digital twin accuracy.
Intuitive Operation: Operating on a Windows-based interface, the programming is remarkably accessible, featuring barcode/QR code program switching and pre-populated component libraries to simplify day-to-day operation.
PowerSelective: The Ultimate Multi-Process Platform
When production scales to high-volume demands or when assemblies feature exceptional geometric complexity, the PowerSelective serves as SEHOās premium, multi-process workstation. Capable of handling large-format boards and heavy carriers up to 500 mm x 500 mm and weighing up to 28 kg, it consolidates multiple production stages into a remarkably small footprint.
The core innovation of the PowerSelective lies in its ability to combine three distinct soldering processes within a single machine cell.
Multi-Wave Dipping: Uses a customised, product-dedicated solder tool to solder an entire board simultaneously in seconds, the fastest possible throughput for dedicated runs.
Mini-Wave Nozzles: Configurable with up to five mini-wave nozzles (Figure 4) on a single solder pot, with distances that adjust automatically depending on the layout of the carrier.
Conventional Wave Integration: The machineās heavy-duty gripper can rotate a full 360 degrees and tilt up to 12 degrees, allowing it to pass boards over an integrated conventional LW wave nozzle at the precise 7-degree angle required for conventional wave soldering.
Every stage within the PowerSelective is stringently monitored, right down to software that counts the exact drop of flux deposited. Efficiency is enhanced via an intelligent “cluster preheat” system that activates only the heating tubes directly beneath the PCB’s current location, saving substantial energy during mixed runs.
To see the inner mechanics, multi-axis gripper movements, and multi-wave capabilities of the newest PowerSelective, watch the overview video from Productronica 2025.
Figure 3 – SYNCHRO – automatic split of process tasks to several stations
Closed-Loop Process Control: Seamless Inline THT AOI and Brushing
True innovation avoids treating quality control as a separate, downstream bottleneck. On advanced platforms such as the PowerSelective and SelectLine-C, inspection and post-solder finishing are natively integrated into the machine conveyor system.
In-Line THT-AOI: SEHO’s bottom-side PowerVision AOI system (Figure 5) operates on its own, completely independent axis. This allows the machine to inspect completed solder joints immediately after they are formed, identifying defects early without adding a single second to the machineās core cycle time.
Integrated Selective Brushing: If a specific heavy component or complex pad geometry is prone to minor solder balling, an automated, software-driven brush station targets those exact coordinates to clean the PCB before it exits the machine, eliminating a secondary manual cleaning step.
This closed-loop approach ensures that any process drift is caught and corrected immediately, maximising yield and upholding the strict standards expected of modern electronic assemblies.
Figure 4 – Miniwave processing
Evaluating Your Through-Hole Soldering Production Path
To determine which technological layer aligns best with your operational objectives, it is useful to evaluate where your primary production constraints lie:
Mid-range, high-mix production lines requiring fast setup, rapid lead times, and strong throughput.
High-mix, high-volume environments that require total process consolidation and large-board handling.
Process Concept
Concurrent board handling via patented Synchro Mode and SmartSplit task distribution.
Three distinct soldering processes (Multi-Wave, Mini-Wave, Conventional Wave) integrated into a single footprint.
Co-Pilot Readiness
Optimised for digital program import. Acts as an offline simulation layer to calculate ideal nozzle travel paths and thermal profiles, which are then imported to feed the machineās native Synchro and SmartSplit high-throughput modes.
Comprehensive process simulation. Acts as a digital twin to mathematically model complex multi-process configurations (such as multi-wave versus mini-wave thermal demands) entirely offline before sending the validated program to the machine.
AOI Integration
Available natively as part of the modular, in-line process control system.
Integrated bottom-side THT-AOI operating on an autonomous axis.
Machine Character
Faster implementation, scalable, and highly cost-conscious.
Comprehensive, fully integrated, and aimed at the most demanding, heavy-payload production cells.
Technical Guidance from Hawker Richardson
Choosing the right advancement path requires more than comparing data sheets. Every PCB assembly has distinct thermal mass, copper weight, and component clearances that dictate how software and hardware must interact.
As the exclusive supplier of premium manufacturing solutions across Australia and New Zealand, Hawker Richardson works directly alongside your engineering and production teams. Our focus remains on identifying the alignment of product fit, software optimisation, and technical guidance needed to future-proof your line.
Deploying advanced technology only works if it is built on a foundation of proven reliability. SEHOās 50-year legacy of precision engineering ensures that advanced capabilities like Solder Copilot and inline THT AOI are not experimental concepts, but mature, industrial-grade solutions backed by five decades of German credibility. To discuss your selective solder requirements, reach out to Hawker Richardson’s technical team today for a comprehensive consultation.
Still running a manual assembly line? If you are not ready for advanced modular platforms, learn how to easily take your first step toward THT automation in our Hand Soldering to Selective Soldering Automation Guide.
Why is through-hole soldering still important in modern electronics manufacturing?
Although surface mount technology (SMT) dominates most PCB assembly, many products still require through-hole components for mechanical strength, high-current applications, large connectors, transformers and other power devices. Reliable through-hole soldering remains essential in industries such as defence, industrial electronics, automotive and power electronics.
What is selective soldering?
Selective soldering is an automated process that solders only specific through-hole components on a PCB using a precision solder nozzle. It is ideal for mixed-technology boards where surface mount components have already been assembled and only selected through-hole joints require soldering.
When should I choose selective soldering instead of wave soldering?
Selective soldering is the preferred choice for complex mixed-technology assemblies, low-to-medium production volumes, or boards with sensitive SMT components. Wave soldering is generally better suited to higher-volume production where entire rows of through-hole components can be soldered simultaneously.
How does automated selective soldering improve product quality?
Automated selective soldering delivers consistent solder volume, precise positioning and repeatable process control. This reduces common defects such as bridges, insufficient solder and inconsistent joints while improving first-pass yield and reducing the need for manual rework.
What features should I look for in a selective soldering system?
Look for features such as accurate flux application, programmable preheating, precise solder nozzle control, automated optical inspection (AOI), process monitoring, recipe management and modular expansion. These capabilities help improve repeatability, productivity and long-term manufacturing flexibility.
Can selective soldering reduce labour costs?
Yes. By automating repetitive through-hole soldering tasks, manufacturers can reduce reliance on manual soldering, improve throughput, minimise operator variability and significantly lower rework costs while maintaining consistent product quality.
Which industries benefit most from advanced through-hole soldering solutions?
Industries producing high-reliability electronicsāincluding defence, aerospace, medical devices, industrial controls, automotive electronics and power conversion equipmentābenefit greatly from advanced selective and wave soldering systems that deliver repeatable, high-quality solder joints.
As SEHO marks 50 years of quality made in Germany, the company continues to invest heavily in the future of automated soldering technology. For five decades, SEHO has engineered selective soldering solutions that set the benchmark for reliability. However, the milestone isn’t simply a celebration of longevity; it marks a profound shift in how electronics manufacturing operates. Today, selective soldering has evolved from a purely machine-focused mechanical process into an ecosystem driven by software guidance, digital twins, and real-time inspection feedback.
