Scienscope Xspection 1860 PCB X-Ray Inspection Machine

The Xspection 1860 can identify a wide range of hidden or internal defects, including voids in solder joints, barrel fill issues in through-hole (THT) components, defects in multilayer boards, and problems underneath BGA / other packages that are not visible to optical inspection.

It has a detection range of 400 × 460 mm (approximately 16″ × 18″) and supports a tilt angle of up to 45°, with an optional 70° tilt in some configurations. This allows oblique angle viewing to help inspect features hidden by board layers or component geometry.

It uses a 90 kV micro-focus sealed X-ray tube, with a flat panel detector of 5″ × 5″, 14-bit, and a pixel size around 85 µm. Spot size down to ~ 5 µm is quoted for high‐detail imaging.

The machine uses stepper motors for motion, enabling programmable / CNC style control. While absolute cycle times depend on inspection complexity, component density, and tilt angles, the system is designed for batch inspections rather than single component rapid scanning.

• Automatic void percentage calculation for solder joints with better background definition.
• Enhanced BGA-inspection tools designed to reduce false alarms.
• Fiducial mark recognition.
• Optional barcode / laser-scanner integration.

• Dimensions (W × D × H): approx. 950 × 1240 × 1780 mm.
• Weight: ~ 1,300 kg.
• Power: AC 110-240 V, 50/60 Hz.

Automatic xray inspection best suited for:

• Electronics manufacturing to detect internal defects (voids, under-BGA solder issues) that optical inspection cannot catch.
• Quality assurance labs or high-reliability industries (automotive, aerospace, medical) where hidden defects are critical.
• Batch inspections of multilayer or complex boards.

Where it might be over-spec’d or less optimal:

• For purely surface or optical defects, an AOI may suffice and be more cost-efficient.
• Very high throughput lines with simpler defect detection needs may find the X-ray cycle times slower than simpler inspection tools.

• The cost of acquisition and ongoing maintenance is higher compared to AOI tools.
• Requires significant space, both physical footprint and supporting infrastructure (power, perhaps cooling or ventilation).
• Operator training is needed to interpret X-ray images correctly and set up defect detection thresholds (to avoid false positives / negatives).
• Some optional features (higher tilt, barcode scanner, detailed mapping camera) may add to cost.