Scienscope AXI 7300 PCB X-Ray Inspection Machine

The AXI-7300 can detect hidden defects such as internal voids, bubbles, insufficient solder, “head-in-pillow” issues under BGA, QFN, QFP packages, and defects in multi-layer structures that are invisible from surface inspection. Its 5-axis tilt, X-ray imaging with high resolution, and grayscale analysis enhance its ability to spot defects inside components.

• Maximum measurable PCB length: 650 mm
• Maximum width: 500 mm
• Maximum height: 70 mm

It uses a micro-focus X-ray tube with a spot size down to 5 µm, allowing very fine detail inspection. Magnification can reach up to 800×.

• The standard inspection area is about 635 × 358 mm.
• The system supports up to 45° 5-axis tilt, letting inspectors view defects at angles to see hidden features.

The machine is a fully shielded radiation enclosure for safety. It uses a closed, high-power, micro-focus X-ray tube (130 kV) and has built-in safety interlocks. It meets relevant safety standards to ensure radiation exposure is contained.

Key software / usability features include:

• Automatic void percentage calculation (void detection)
• Barcode recognition (optional) for automated traceability
• Offline programming mode, so inspections can be prepared in advance or for non-line work
• Report storage, repair station support, discrepancy comparator optional add-ons

• Dimensions (L × W × H): approx. 1600 → 1685 × 1685 × 1680 mm
• Weight: about 3,500 kg
• Power: AC 110-240 V, 50/60 Hz input; additional utility / environmental support as needed for cooling and airflow.

• Throughput vs resolution: Higher resolution inspections, 5-axis tilt, or large PCBs may slow throughput; for very high volume lines this may be a bottleneck.
• Size and cost: It is a large and heavy machine; floor space, installation cost, and supporting infrastructure (power, cooling, safety) need to be considered.
• Optional features may add cost: Barcode, additional detector sizes (e.g. different FPD choices), discrepancy comparator, etc., are optional and may increase cost and complexity.
• Operator training required: Given its advanced features (tilt, void detection, complex software), skilled personnel are needed to get full benefit and avoid false positives/negatives.