Hawker Richardson Supplies PacTech Semiconductor Packaging Equipment Across Australia and New Zealand

Hawker Richardson Appointed Official PacTech Supplier for advanced semiconductor packaging equipment across Australia and New Zealand, giving local manufacturers, research organisations and universities access to specialist machines for laser soldering, solder ball jetting, wafer bumping, solder ball placement and semiconductor assembly.

PacTech develops precision equipment for advanced semiconductor packaging, wafer-level packaging and microelectronics manufacturing. Its technology supports applications ranging from research, product development and prototyping through to automated, high-volume semiconductor production.

Through Hawker Richardson, businesses in Victoria, New South Wales, Queensland, South Australia, Western Australia, Tasmania, the Australian Capital Territory, the Northern Territory and New Zealand can discuss PacTech equipment selection, process requirements, installation, training and ongoing technical support.

Advanced Semiconductor Packaging Equipment for Australia and New Zealand

As semiconductor devices become smaller, more powerful and increasingly complex, conventional electronic assembly processes may not provide the accuracy, thermal control or process flexibility required.

Advanced semiconductor packaging brings semiconductor dies, substrates, interconnects and other components together within a finished package. These processes can include:

• Wafer-level chip scale packaging, or WLCSP
• Flip chip packaging and assembly
• Fan-in and fan-out wafer-level packaging
• Solder bumping and wafer bumping
• Solder ball attach and placement
• Laser solder jetting
• Laser-assisted soldering and reflow
• Die-to-wafer and chip-to-substrate interconnection
• Ball grid array assembly and rework
• MEMS and sensor packaging
• Optical, photonic and optoelectronic packaging
• 2D, 2.5D and 3D semiconductor packaging
• Wire soldering and specialist interconnection processes

PacTech machines provide semiconductor manufacturers with controlled and highly localised soldering processes. This can help minimise the thermal load placed on surrounding materials while enabling accurate solder deposition in areas that may be difficult to reach using conventional soldering equipment.

PacTech Laser Solder Jetting and Solder Ball Attach Machines

PacTech’s SB²® equipment range uses laser energy to melt and deposit individual solder balls in precisely controlled locations.

The solder ball is supplied through a capillary and melted using laser energy before being deposited and immediately reflowed at the selected position. This contactless process supports accurate and repeatable soldering while limiting the transfer of heat to the wider assembly.

PacTech laser solder jetting machines can be used for applications including semiconductor packages, wafers, substrates, MEMS devices, camera modules, CMOS sensors, optical components, connectors, hard disk drive assemblies and other microelectronic products.

SB²® – Compact Ultra-Compact Laser Soldering Machine

The SB²® – Compact provides an accessible entry point into PacTech laser soldering technology. Its ultra-compact workstation is suited to manufacturers, engineering teams and research facilities that require precision laser soldering without the footprint or investment associated with a larger production platform.

The machine is designed to combine process flexibility with a comparatively low cost of ownership, making it suitable for specialist microelectronics assembly, development work and selected production applications.

View the PacTech SB²® – Compact laser soldering machine

SB²® – SM Sequential Solder Ball Attach Machine

The SB²® – SM is a sequential solder ball attach and laser reflow machine designed for research and development, prototyping and small-volume manufacturing.

It can operate in automatic or semi-automatic modes and provides a larger working area than smaller PacTech platforms while maintaining a more compact footprint than the high-volume SB²® – Jet.

The system is particularly relevant to Australian and New Zealand organisations searching for a precision solder ball placement machine for semiconductor prototyping, microelectronics research or low-volume advanced packaging production.

View the PacTech SB²® – SM sequential solder ball attach machine

SB²® – Jet High-Speed Solder Ball Attach and Laser Reflow Machine

The SB²® – Jet is PacTech’s flagship high-speed platform for automated sequential solder ball attach and laser reflow.

Developed for precision and reliable performance in volume-production environments, it can accommodate different microelectronic substrates and advanced packaging applications. Available capabilities can include automated handling, inspection, height measurement and solder ball rework.

The SB²® – Jet supports applications such as:

• Chip-scale packaging
• Flip chip assembly
• Single-chip ball grid arrays
• 3D solder jetting
• MEMS and sensor packaging
• Camera modules
• Optoelectronics and micro-optics
• PCB and semiconductor package rework

View the PacTech SB²® – Jet high-speed solder ball attach machine

SB²® – WB Solder Ball Jetting Machine with Wire Feeding

The SB²® – WB combines PacTech solder ball jetting technology with an integrated wire-feeding mechanism for specialist wire soldering and interconnection processes.

Rather than operating as a conventional ultrasonic wire bonder, the machine uses controlled solder ball jetting to create wire connections. It is suitable for applications involving optical fibres, connectors, IC packages, LED packages and complex 2D or 3D assemblies.

The SB²® – WB provides an alternative for manufacturers searching for laser wire soldering equipment, contactless wire joining technology or a solder ball jetting machine with wire-feeding capability in Australia or New Zealand.

View the PacTech SB²® – WB wire soldering and solder ball jetting machine

SB²® – USP Universal Laser Soldering Platform

The SB²® – USP is a universal, automated platform developed for high-volume laser soldering and joining applications.

It can combine multiple robots with PacTech process modules such as solder jetting, laser wire soldering, wire bonding, dispensing and laser reflow. This modular approach allows the platform to support more complex semiconductor packaging and microelectronics assembly processes that may require several joining operations.

View the PacTech SB²® – USP automated laser soldering platform

Automated Wafer Bumping and Solder Ball Placement Equipment

PacTech also supplies fully automated equipment for wafer-level solder bumping and solder ball placement.

These technologies are used to create the electrical and mechanical interconnections required for wafer-level chip scale packaging, flip chip devices and other advanced semiconductor packages.

Ultra-SB²® Automated Solder Bumping Machine

The Ultra-SB²® is a fully automated solder bumping and solder ball placement machine. It integrates several wafer-processing stages within one system, which can include:

• Flux printing
• Solder ball placement
• Pre-balling wafer inspection
• Post-balling 2D inspection
• Wafer-map management
• Wafer-level solder ball rework
• Automated cassette-to-cassette wafer handling

The system supports 6-inch to 12-inch wafers and is designed for both prototyping and volume production.

Typical applications include:

• WLCSP solder ball placement
• Flip chip solder bumping
• Fan-in wafer-level packaging
• Fan-out wafer-level packaging
• Wafer bumping
• Solder bumping on substrates
• Semiconductor wafer rework

For Australian and New Zealand manufacturers seeking an automated wafer bumping machine or solder ball placement machine, the Ultra-SB²® provides a combined production and inspection solution.

PacTech Wet-Bench and Wafer Processing Equipment

PacTech’s equipment portfolio extends beyond laser soldering and solder ball placement to include wet-processing systems used in semiconductor and wafer-level packaging.

Modular Wet-Bench Equipment

PacTech modular wet benches can be configured for specialist semiconductor and wafer-processing applications.

Depending on the required process, wet-bench equipment may support cleaning, surface preparation, activation, plating and other chemical processing stages used in wafer bumping and advanced packaging.

A modular configuration allows the equipment to be adapted around process requirements, available production space and the level of automation required.

Semiconductor Applications Supported by PacTech Equipment

PacTech advanced packaging machines can support manufacturers and research teams working across a wide range of semiconductor and microelectronics applications, including:

Wafer-Level Chip Scale Packaging

Wafer-level chip scale packaging allows packaging processes and external interconnections to be created while devices remain in wafer form. PacTech solder ball placement and wafer bumping equipment supports the formation of solder bumps used in WLCSP production.

Flip Chip Packaging

Flip chip assembly connects a semiconductor die directly to a substrate through solder bumps. Automated solder bumping, precise solder ball placement and controlled laser reflow can support the manufacture of reliable flip chip interconnections.

Fan-In and Fan-Out Wafer-Level Packaging

PacTech equipment can support solder bumping processes used in fan-in and fan-out wafer-level packages, including the accurate placement and inspection of solder balls across semiconductor wafers and substrates.

MEMS and Sensor Packaging

MEMS devices, CMOS sensors and other miniature components often require precise joining with limited thermal exposure. Contactless laser solder jetting can apply localised energy to the connection area while reducing the impact on adjacent structures.

Optical and Photonic Packaging

Laser solder jetting and specialist wire soldering can be used for optical fibres, optical components, photonic devices, micro-optics and optoelectronic assemblies that require controlled, high-precision interconnections.

Automotive, Aerospace and Defence Electronics

Advanced automotive, aerospace and defence electronics may require compact packages, dependable interconnections and repeatable manufacturing processes. PacTech equipment can support the development and production of specialised electronic and semiconductor assemblies for these demanding sectors.

Medical and Research Applications

Research institutions, universities and medical technology manufacturers can use PacTech equipment for semiconductor process development, sensor packaging, prototyping and specialist low-volume production.

PacTech Equipment Support Across Australia and New Zealand

Hawker Richardson supports businesses throughout Australia and New Zealand, including semiconductor manufacturers, electronics companies, contract manufacturers, research laboratories, universities and product-development teams.

Our regional coverage includes:

• Melbourne and regional Victoria
• Sydney and regional New South Wales
• Brisbane and regional Queensland
• Adelaide and South Australia
• Perth and Western Australia
• Tasmania
• Australian Capital Territory
• Northern Territory
• Auckland, Christchurch, Wellington and locations throughout New Zealand

By working with Hawker Richardson, customers can discuss the complete application rather than selecting equipment from specifications alone. Important considerations can include solder ball size, alloy, wafer or substrate dimensions, pad material, placement accuracy, throughput, inspection, automation, rework and future production requirements.

Find the Right PacTech Machine for Your Application

The most appropriate PacTech system will depend on whether the application involves development, prototyping, small-volume manufacturing or fully automated high-volume production.

Hawker Richardson can help Australian and New Zealand organisations evaluate PacTech equipment for:

• Semiconductor packaging and assembly
• Advanced microelectronics manufacturing
• Laser solder jetting
• Precision laser soldering
• Automated solder ball attach
• Wafer bumping and solder bumping
• WLCSP and flip chip packaging
• MEMS and sensor assembly
• Optical and photonic packaging
• Semiconductor package rework
• Research and process development
• Automated wafer handling and inspection

Contact Hawker Richardson to discuss PacTech advanced packaging equipment, production requirements and technical support across Australia and New Zealand.