Solder Ball Jetting Machine with Wiring Process

Hawker Richardson is the authorised supplier of PacTech advanced packaging equipment throughout Australia and New Zealand. We work with manufacturers, research organisations and universities to provide expert advice, equipment selection, installation and ongoing technical support for PacTech laser wire bonding solutions. Our team supports customers across Victoria, New South Wales, Queensland, South Australia, Western Australia, Tasmania, the Australian Capital Territory, the Northern Territory and New Zealand, helping businesses implement advanced semiconductor packaging and microelectronics manufacturing technologies.

The SB²® – WB is designed for precision laser wire bonding in advanced semiconductor packaging. It is ideal for applications including IC packaging, LED packaging, optical devices, sensor manufacturing, connector assembly and other microelectronic packaging processes where accurate, reliable wire bonding is required.

Unlike conventional thermosonic or ultrasonic wire bonding, laser wire bonding uses a highly controlled laser process to create the bond. This reduces mechanical stress on sensitive components, provides greater process control and can improve bond quality for demanding semiconductor and advanced packaging applications.

The SB²® – WB is suitable for a wide range of applications, including semiconductor packaging, flip chip assembly, LED manufacturing, MEMS devices, optical components, sensor packaging, RF devices and research and development environments where flexible, precision wire bonding is required.

Yes. The SB²® – WB is designed to support research and development, prototype manufacturing, low-volume production and specialist manufacturing environments. Its flexible process capabilities make it an excellent solution for organisations developing new packaging technologies as well as producing finished products.

A laser wire bonding machine offers highly accurate energy delivery, minimal thermal impact on surrounding components, excellent repeatability and precise bond placement. These benefits make laser wire bonding particularly suitable for advanced semiconductor packaging and delicate electronic assemblies.

Laser wire bonding equipment is used across the semiconductor, microelectronics, photonics, automotive electronics, aerospace, medical device and telecommunications industries where reliable, high-precision electrical interconnections are essential.

Yes. The SB²® – WB has been developed for advanced packaging applications, supporting manufacturers working with modern semiconductor technologies that demand precise wire placement, reliable bonding and consistent process repeatability.

The PacTech SB²® – WB combines proven laser processing technology with precision automation to deliver flexible, reliable wire bonding for advanced semiconductor manufacturing. It provides an innovative solution for demanding applications where accuracy, repeatability and process flexibility are critical.