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The PacTech SB²® – Compact is a compact laser soldering machine designed for manufacturers looking to introduce highly accurate, automated laser soldering into high-volume production. Combining PacTech’s proven SB²® laser soldering technology with an ultra-compact footprint, the system delivers precise, fluxless soldering while minimising thermal stress on sensitive electronic components.
Ideal for camera modules, sensors, optical devices and other microelectronics applications, the SB²® – Compact provides an economical entry point into automated laser soldering without compromising precision or flexibility. Its selective, contactless soldering process helps improve product quality, reduce maintenance and lower operating costs, making it an excellent solution for manufacturers seeking reliable, scalable production equipment.
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The PacTech SB²® – Compact is a precision laser soldering machine designed for automated microelectronics manufacturing. It is ideal for applications such as camera modules, sensors, optical devices, semiconductor packaging and other assemblies that require accurate, repeatable soldering with minimal thermal impact.
A compact laser soldering machine provides precise, contactless heating, helping to reduce thermal stress on sensitive components while improving solder joint quality. Its small footprint also makes it ideal for production environments where floor space is limited without compromising process performance.
Laser soldering equipment is widely used in the semiconductor, automotive electronics, medical device, aerospace, telecommunications, photonics and consumer electronics industries. It is particularly suited to applications requiring highly accurate soldering of miniature electronic components.
Yes. The SB²® – Compact has been designed for automated manufacturing and can be integrated into production lines requiring consistent, repeatable laser soldering. Its flexible configuration makes it suitable for both specialist manufacturing and high-volume production environments.
Laser soldering delivers highly localised heat directly to the solder joint, reducing thermal stress on surrounding components. This improves process control, increases repeatability and produces high-quality solder joints, making it ideal for advanced electronic and semiconductor manufacturing.
The SB²® – Compact is suitable for soldering camera modules, MEMS devices, sensors, optical assemblies, semiconductor packages, connectors and other precision electronic components where reliable, repeatable soldering is essential.
Hawker Richardson is the authorised supplier of PacTech advanced packaging equipment throughout Australia and New Zealand. We support manufacturers, universities and research organisations across Victoria, New South Wales, Queensland, South Australia, Western Australia, Tasmania, the Australian Capital Territory, the Northern Territory and New Zealand, providing equipment selection, installation, training and ongoing technical support for PacTech laser soldering solutions.
The PacTech SB²® – Compact combines precision laser soldering technology with a space-saving design, making it an excellent solution for manufacturers seeking reliable, automated soldering for advanced microelectronics. It offers high process accuracy, excellent repeatability and the flexibility to support a wide range of production applications.