Sequential Solder Ball Attach Machine

The SB²® – SM is designed for precision sequential solder ball placement and laser reflow in semiconductor and advanced electronics manufacturing. It is ideal for research and development, prototyping, process development and low-volume production where highly accurate solder ball attachment is required.

The SB²® – SM is commonly used for:

• Wafer-level packaging (WLP)
• Semiconductor packaging
• Flip chip assembly
• BGA package repair and reballing
• Advanced packaging research
• Microelectronics manufacturing
• Prototype and pilot production

The SB²® – SM offers the same precision sequential solder ball placement technology as the SB²® – Jet but in a more compact, cost-effective platform. It provides a larger working area than the SB²® – M while being better suited to R&D laboratories, engineering departments and lower-volume manufacturing than the higher-throughput SB²® – Jet.

Yes. The SB²® – SM supports both fully automatic and semi-automatic operation, allowing manufacturers to optimise the system for process development, engineering trials or repeatable production depending on their application.

The SB²® – SM is capable of handling a wide range of solder ball sizes, depending on the application and configuration. Please contact Hawker Richardson for the recommended specification for your semiconductor packaging or advanced electronics manufacturing process.

Absolutely. The system has been specifically developed for R&D, process development, prototyping and low-volume manufacturing, making it an excellent solution for universities, research institutes, semiconductor manufacturers and engineering teams developing new packaging technologies.

Hawker Richardson is the authorised distributor of PacTech SB²® – SM sequential solder ball placement systems throughout Australia and New Zealand. Our specialists can provide application advice, demonstrations and local technical support to help you select the right solution for your manufacturing requirements.

Laser reflow provides highly accurate, localised heating without contact, helping reduce thermal stress on surrounding components while delivering consistent solder ball attachment. This makes it particularly well suited to advanced semiconductor packaging, wafer-level packaging and other high-precision microelectronics applications.