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Home / Electronic Production Equipment / Soldering / selective-soldering-machines / RPS Vector Selective Soldering

RPS Vector Selective Soldering

The RPS Vector selective soldering machine is a powerful system featuring a space-saving footprint. Designed for high mix, high value, and low to mid volume PCB production environments. It can be programmed in minutes and can handle basic to complex dip, drag, wire bond and other through-hole soldering processes previously performed by hand or wave soldering.

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RPS Vector Selective Soldering
Features
Technical Details
Related Products

Features

The Vector soldering system features best-in-class servo motor motion control, providing speed, accuracy, and repeatability. A superior thermal performance miniwave is achieved with the use of a closed loop temperature controlled nitrogen insertion process. RPS Automation offers innovative miniwave nozzle designs for wave stability and defect free performance.

Applications:

  • Blue chip
  • OEM and CEM companies
  • Dip & Drag Soldering
  • Lead Attach
  • Point-to-Point Soldering
  • Large PCB Mid Volume High Precision Configurable

Key Features:

  • 18” x 18” Standard Process Range
  • 1.5 mm Standard (Capable of 0.5mm) Keep Away
  • 6mm Lead Length Tolerance
  • +/- 0.05 mm Repeatability
  • +/- 0.25 mm Wave Stability
  • Off-line Programming Via RPS ConductorPRO™ Software
  • Low Maintenance: 80 Hour Pump Cleaning Cycle
  • Low Consumables: Dross production of 1-2 ounces per shift

Key Benefits:

  • Soldering process of all kinds
  • Space saving footprint
  • Lowest dross production
  • Made in USA
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Virtual Demo

This product is available to view in our virtual demo.

Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.

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More information

Technical Details

Specifications
Vector Soldering Operation
X/Y/Z Control Closed Loop Servo Motors
X/Y/Z Motion | Accuracy Lead Screw | ± .002″
Interpolated Motion Yes | Simultaneous X, Y and Z
Max Speed Ω X/Y axes @ 5” per second
Max Process Range 18 x 18” | 300 x 450 mm
Min/Max PCB Size 1 x 1” to 18 x 18” | 25 x 25 mm to 460 x 460 mm
Load Method Manual | Universal PCB Holder
Inline SMEMA Load Option | SMEMA Edge Belt
Solder Process Control
Approach 360° | Access to All Solder Points
Nozzle Material Wetted Alloy
Nozzle Sizes (ID)1.5, 2, 2.5, 3, 4, 5, 8, 10, 20 mm & custom
Keep Away 1.5mm Standard | 0.5mm Capable
Max Wave Height 6mm Standing Wave Height
Component Max Height 3” | Top & Bottom of PCB
Flux Process Control
Spray Fluxer Standard | Stainless Steel
Drop Jet Fluxer *0.5 – 2mm | 14% Solids Max
Ultrasonic Fluxer* 1 – 5mm | 40% Solids Max
Dual Fluxers / Chemistry* Two Independent Nozzles & Plumbing
Flux Capacity 1 Litre Pressurised (per tank)
Solder Pot Management
Solder Pot Capacity 60 lbs | 27 kgs
Temp Control PID proportioning (0-400°C) ± 2°C
Heat Time 60 Minutes
HMP Upgrade* Option
Dross Production 1.5 Ounces per 8 Hours
Maintenance Cycle 80 Hour Pump Clean | 30 Minutes
Nitrogen Management
N2 Inertion RPS Proheat™
N2 Temp Control 0-400 °C Closed Loop | Adjustable Set Point
N2 Consumption | Purity 30-35 CFH | <20 PPM O2
Vector 460 Requirements
Safety UL and CE Compliant Electrical 208-240 VAC | 1Ø 3 Wire | 50-60hz | 30 amp
Dimension (D-L-H) 58 x 55 x 50” | L 60” inline Weight 1000 lbs | 450 kgs Air 80 PSI | Clean and Dry Nitrogen N2 <20 PPM O2 | 35 SCFH N2
Ship Weight 1250 lbs | 375 kgs Exhaust 25 SCFH (ft3)
Specifications
Vector Soldering Operation
X/Y/Z Control Closed Loop Servo Motors
X/Y/Z Motion | Accuracy Lead Screw | ± .002″
Interpolated Motion Yes | Simultaneous X, Y and Z
Max Speed Ω X/Y axes @ 5” per second
Max Process Range 18 x 18” | 300 x 450 mm
Min/Max PCB Size 1 x 1” to 18 x 18” | 25 x 25 mm to 460 x 460 mm
Load Method Manual | Universal PCB Holder
Inline SMEMA Load Option | SMEMA Edge Belt
Solder Process Control
Approach 360° | Access to All Solder Points
Nozzle Material Wetted Alloy
Nozzle Sizes (ID)1.5, 2, 2.5, 3, 4, 5, 8, 10, 20 mm & custom
Keep Away 1.5mm Standard | 0.5mm Capable
Max Wave Height 6mm Standing Wave Height
Component Max Height 3” | Top & Bottom of PCB
Flux Process Control
Spray Fluxer Standard | Stainless Steel
Drop Jet Fluxer *0.5 – 2mm | 14% Solids Max
Ultrasonic Fluxer* 1 – 5mm | 40% Solids Max
Dual Fluxers / Chemistry* Two Independent Nozzles & Plumbing
Flux Capacity 1 Litre Pressurised (per tank)
Solder Pot Management
Solder Pot Capacity 60 lbs | 27 kgs
Temp Control PID proportioning (0-400°C) ± 2°C
Heat Time 60 Minutes
HMP Upgrade* Option
Dross Production 1.5 Ounces per 8 Hours
Maintenance Cycle 80 Hour Pump Clean | 30 Minutes
Nitrogen Management
N2 Inertion RPS Proheat™
N2 Temp Control 0-400 °C Closed Loop | Adjustable Set Point
N2 Consumption | Purity 30-35 CFH | <20 PPM O2
Vector 460 Requirements
Safety UL and CE Compliant Electrical 208-240 VAC | 1Ø 3 Wire | 50-60hz | 30 amp
Dimension (D-L-H) 58 x 55 x 50” | L 60” inline Weight 1000 lbs | 450 kgs Air 80 PSI | Clean and Dry Nitrogen N2 <20 PPM O2 | 35 SCFH N2
Ship Weight 1250 lbs | 375 kgs Exhaust 25 SCFH (ft3)

FAQs: Your RPS Vector Selective Soldering Questions Answered

1. What PCBs / board sizes can the RPS Vector handle?

The Vector supports boards from 1 × 1 in (≈ 25 × 25 mm) up to 18 × 18 in (≈ 460 × 460 mm).

2. How precise is the machine in terms of repeatability and alignment?

It offers a repeatability of ± 0.05 mm, with a lead-screw and closed-loop servo motion system for the X/Y/Z axes.

3. What is the minimum / maximum component or lead geometry it can work with?
  • Standard “keep away” is 6 mm lead length tolerance.
  • Nozzles support from 1.5 mm standard, capable down to 0.5 mm with custom setup.
4. What kind of thermal performance & soldering process control does it offer?

The Vector uses a closed-loop temperature controlled nitrogen insertion process (“mini-wave”) to maintain wave stability and better solder quality. It has PID temperature control from 0-400 °C ±2 °C.

5. Which fluxing and solder pot features does it include?
  • Flux options include spray fluxer (stainless steel), drop-jet fluxer (0.5-2 mm), and ultrasonic fluxer (1-5 mm) depending on solids content.
  • Solder pot capacity of ~ 60 lbs (≈ 27 kg) with multiple nozzle sizes. Maintenance cycles include an 80-hour pump clean.
6. What are the power, utility, and footprint requirements for installation?
  • Electrical: 208-240 VAC, single-phase, 30 amp supply.
  • Nitrogen: inert atmosphere with < 20 ppm O₂, ~ 30-35 SCFH (standard cubic feet per hour).
  • Size: Rough footprints are ~ 58 × 55 × 50 in (for standard), larger if the inline/SMEMA option is used. Weight about 450 kg (≈ 1000 lbs).
7. Which soldering styles (dip, drag, wire bond etc.) can it perform, and how fast is it?

The machine handles dip & drag soldering, point-to-point / wire bond and other through-hole operations that were traditionally done by hand or wave. It’s designed for low to mid-volume production with high mix. Programming is fast (minutes), and nozzles are designed for wave stability.

8. What are the benefits versus trade-offs / what to check before investing?

Benefits:

  • Space-saving footprint vs full wave soldering lines.
  • Lower dross (solder waste) production (1-2 oz per shift typical).
  • High accuracy, good thermal control, configurable for various soldering styles.

Trade-offs / Considerations:

  • Requires clean dry nitrogen supply and good environmental control to achieve the best thermal results.
  • Operational training needed for setting up nozzles, keep-away distances, proper flux chemistry etc.
  • Maintenance: while low, pumps, fluxer systems, solder pot cleaning still require regular upkeep.
  • For very large/tall boards or extremely high throughput, a selective solder machine may still be slower than wave for mass through-hole volumes.

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