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The Yamaha YSP10 was developed to deliver high-accuracy and high-quality printing performance with accelerated cycle times, crucial in determining the quality of the overall mounting process.
The YSP10 high-end printer which featured 3S heads and stencil suction mechanism as standard equipment. The YSP10 has been newly designed and developed from the ground up in order to enable full automation of production changeover work, which occupies the most working hours in printing processes.
In addition to existing automatic program changeover and Print Stability Control (PSC) systems, full automation of changeover work is achieved by including the new automatic push-up pin exchange, automatic stencil replacement, and automatic solder transfer functions (all of which are optional). In addition, the cycle time (including stencil cleaning) has been improved by 20% compared to previous models. Other enhancements include compatibility with a wider range of circuit board sizes and the new cleaner head achieving a significant reduction in cleaning paper consumption volume.
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
If you’d like more information first click below.
| Model | YSP10 |
| Applicable PCB | L 510 x W 510 mm to L 50 x W 50 mm (option: L 610 x W 510 mm) |
| Printing head | 3S head (3S: Swing Single Squeegee) |
| Printing accuracy | Positioning repeatability (6 σ): +/– 10 μm |
| Printing line tact | 10 sec (Standard printing: under optimum condition, including board transfer time and printing time) |
| Applicable stencil size   L 750 x W 750 mm | L 736 x W 736 mm (29″) L 750 x W 650 mm L 650 x W 550 mm L 584 x W 584 mm (23″) |
| Power supply | Single-phase AC 200 to 230 V +/– 20 V |
| Air supply source | 0.45 MPa or more |
| External dimension (excluding projections) | L 1,640 x W 1,990 x H 1,525 mm (full range of options) |
| Weight | Approx. 1,700 kg |
| Model | YSP10 |
| Applicable PCB | L 510 x W 510 mm to L 50 x W 50 mm (option: L 610 x W 510 mm) |
| Printing head | 3S head (3S: Swing Single Squeegee) |
| Printing accuracy | Positioning repeatability (6 σ): +/– 10 μm |
| Printing line tact | 10 sec (Standard printing: under optimum condition, including board transfer time and printing time) |
| Applicable stencil size   L 750 x W 750 mm | L 736 x W 736 mm (29″) L 750 x W 650 mm L 650 x W 550 mm L 584 x W 584 mm (23″) |
| Power supply | Single-phase AC 200 to 230 V +/– 20 V |
| Air supply source | 0.45 MPa or more |
| External dimension (excluding projections) | L 1,640 x W 1,990 x H 1,525 mm (full range of options) |
| Weight | Approx. 1,700 kg |
The YSP10 supports PCBs from 50 × 50 mm up to 510 × 510 mm. There is an optional extension for boards up to 610 × 510 mm.
It supports multiple stencil/frame sizes, including 750 × 750 mm; 736 × 736 mm (29″); 750 × 650 mm; 650 × 550 mm; and 584 × 584 mm (23″).
Under optimal conditions, the core print cycle is 10 seconds (including board transfer and printing). When including stencil cleaning, the full cycle is about 12 seconds.
Positioning repeatability is ±0.01 mm (6σ) for standard operations. This high precision supports tight tolerances in SMT printing.
Optional features include automatic stencil replacement, automatic push-up pin exchange, automatic solder paste transfer, and full automation of changeover work. These help reduce downtime and operator labour.
It uses the 3S head (Swing Single Squeegee) and includes a stencil suction mechanism as standard. These features help improve print stability, reduce droop, and improve accuracy.
Power: single-phase AC 200-230 V ±20 V. Air supply: ≥ 0.45 MPa. Size (excluding projections): ~1,640 × 1,990 × 1,525 mm. Weight: ~1,700 kg.
Compared to earlier versions, the YSP10 improves cycle time including cleaning by about 20%. It also features a new cleaner head which significantly reduces cleaning paper consumption.