Reflow Shuttle O₂

The Reflow Shuttle O₂ is a process-measurement shuttle for reflow ovens which captures multiple critical parameters in a single pass. Key measurements include: temperature profiles (top & bottom heaters, zone-by-zone), oxygen ppm (if the O₂ sensor module is fitted), conveyor vibration in all three axes, vacuum (optional), and conveyor speed.

Monitoring oxygen ppm zone-by-zone allows detection of nitrogen leaks or insufficient inerting, helps optimize nitrogen consumption, and ensures the atmosphere remains within acceptable limits for reducing oxidation, improving wetting, and minimizing defects.

There are two physical size variants:

• Single-Lane: 350 mm wide × 395 mm long
• Dual-Lane: 200 mm wide × 395 mm long

The choice depends on oven width and whether you need single or dual lane profiling.

The shuttle includes a 3-axis vibration sensor (±2 g @ 12 Hz) with a sensitivity of ~0.244 mg. Measuring vibration helps detect issues like conveyor misalignment, fan or blower imbalance, or other mechanical oscillations that can impact the soldering quality (e.g., component movement or misplacement).

Yes — there is an optional vacuum sensor module that can measure vacuum depths down to ~10 mbar (±1.5 mbar). This is especially useful in reflow ovens that include a vacuum stage to avoid component shift, voiding, or solder paste defects.

The oxygen sensor (optional module) has a range from ~2000 ppm down to ~20 ppm, with a resolution of about ±0.5 ppm and accuracy of about ±5% full scale.

It’s designed for use without a PCB; you simply pass the shuttle through the reflow oven as you would a board. It uses the Smartlink system to connect to the SLX Datalogger, with auto-configured measurements so there’s minimal setup. It is ideal for daily verification, machine qualification, and verification after maintenance.

• The O₂ sensor is optional; without it you won’t have oxygen ppm data.
• Even with the data, controlling O₂ in the oven depends on nitrogen flow, oven sealing, air curtains, etc.—hardware and process must support achieving required atmosphere.
• Measurements are taken without a PCB installed, so while thermal & atmosphere conditions are captured, actual loading, board mass, etc., can affect results in production.
• Size variant selection is critical: a shuttle that doesn’t span the oven zone or matches lane width poorly may not give representative data.