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Home / Electronic Production Equipment / Electronics Prototyping And Entry Level / manual-pick-and-place-systems / MP904 Manual Pick and Place System

MP904 Manual Pick and Place System

With the ability to handle a wide range of components, the MP904 accurately places fine pitch, BGA and QFN components seamlessly due to the smooth-running guide on the mounting head. The solid construction of the handling head ensures a high precise placement of SMDs.

Featuring Split-Field Vision enables viewing of multiple angles of the component as well as the vision system produces dual images to be viewed simultaneously when placing components.

  • Dispensers
  • X/Y/X locking
  • Software
  • Camera fixture
  • Head lighting
  • Feeder

 

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MP904 Manual Pick and Place System
mp904-manual-pick-and-place-system_whnfm39d_1200.jpg
mp904-manual-pick-and-place-system_wy5dzjhg_1200.jpg
MP904 Manual Pick and Place System
mp904-manual-pick-and-place-system_whnfm39d_1200.jpg
mp904-manual-pick-and-place-system_wy5dzjhg_1200.jpg
Features
Technical Details
Related Products

Features

  • Entry-level and affordable manual assembly solution
  • Starting from chip-size 0201 
  • The MP 904 is qualified for the assembling of high-grade prototypes and small series
  • Comfortable and fatigue-free work
  • Affordable
  • Vision system
  • Flexible component feeder
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Virtual Demo

This product is available to view in our virtual demo.

Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.

If you’d like more information first click below.

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Technical Details

Specifications
Specs
max. dimensions: 1200 x 700 mm
max. PCB size: 340 x 250 mm
max. placement area: 340 x 250 mm
Specifications
Specs
max. dimensions: 1200 x 700 mm
max. PCB size: 340 x 250 mm
max. placement area: 340 x 250 mm

FAQs: Your MP904 Manual Pick and Place System Questions Answered

1. What is the component range the MP904 supports, especially for fine-pitch and BGA/QFN parts?

The MP904 can handle components starting from 0201 chip size, through fine-pitch, QFN and BGA. Its solid handling head and smooth guide rails allow accurate placement of these delicate components.

2. What is the maximum PCB size and placement/work area of the MP904?

The MP904 supports PCBs up to 340 × 250 mm, which is also the maximum placement area.

3. What are the overall machine footprint and maximum working envelope?

The overall machine dimensions are approximately 1,200 × 700 mm, with sufficient clearance for manual operation; the max working envelope / throat for the head is sized to suit the 340 × 250 mm board.

4. What vision or inspection features does the MP904 include to assist precise placement?

It includes a Split-Field Vision system that allows viewing from multiple angles (component underside and PCB) simultaneously during placement, helping with correct orientation, alignment especially for BGAs/QFNs.

5. How is ergonomic comfort and usability addressed by the MP904 in manual operation?

Features like head lighting, camera fixture, comfortable hand-rest, smooth-running guide on the mounting head, and locking for X/Y/Z axes improve operator ease and reduce fatigue.

6. Can the MP904 be equipped with dispensing capability for paste or adhesive?

Yes — there is an optional dispenser unit that can be mounted to the assembly head to apply solder paste or adhesive, with controlled time/pressure dispensing.

7. What throughput (components placed per hour) is realistic for an experienced operator using the MP904?

With an experienced operator, around 300-600 SMD placements per hour is realistic, depending on component mix, board complexity, and use of the vision system.

8. What are the key trade-offs of using a manual pick & place system like the MP904 vs a semi-automatic or fully automatic system?

Manual systems like MP904 offer lower capital cost, flexible component handling, and precision for prototypes / small series. However, trade-offs include lower throughput, greater dependence on operator skill, and potentially slower assembly time for high volume runs.

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