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With the ability to handle a wide range of components, the MP904 accurately places fine pitch, BGA and QFN components seamlessly due to the smooth-running guide on the mounting head. The solid construction of the handling head ensures a high precise placement of SMDs.
Featuring Split-Field Vision enables viewing of multiple angles of the component as well as the vision system produces dual images to be viewed simultaneously when placing components.
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
If you’d like more information first click below.
| Specs |
| max. dimensions: 1200 x 700 mm |
| max. PCB size: 340 x 250 mm |
| max. placement area: 340 x 250 mm |
| Specs |
| max. dimensions: 1200 x 700 mm |
| max. PCB size: 340 x 250 mm |
| max. placement area: 340 x 250 mm |
The MP904 can handle components starting from 0201 chip size, through fine-pitch, QFN and BGA. Its solid handling head and smooth guide rails allow accurate placement of these delicate components.
The MP904 supports PCBs up to 340 × 250 mm, which is also the maximum placement area.
The overall machine dimensions are approximately 1,200 × 700 mm, with sufficient clearance for manual operation; the max working envelope / throat for the head is sized to suit the 340 × 250 mm board.
It includes a Split-Field Vision system that allows viewing from multiple angles (component underside and PCB) simultaneously during placement, helping with correct orientation, alignment especially for BGAs/QFNs.
Features like head lighting, camera fixture, comfortable hand-rest, smooth-running guide on the mounting head, and locking for X/Y/Z axes improve operator ease and reduce fatigue.
Yes — there is an optional dispenser unit that can be mounted to the assembly head to apply solder paste or adhesive, with controlled time/pressure dispensing.
With an experienced operator, around 300-600 SMD placements per hour is realistic, depending on component mix, board complexity, and use of the vision system.
Manual systems like MP904 offer lower capital cost, flexible component handling, and precision for prototypes / small series. However, trade-offs include lower throughput, greater dependence on operator skill, and potentially slower assembly time for high volume runs.