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The LM901 is a fatigue-free, cost-efficient manual assembly system ideal for prototyping and small-series production. The LM901 efficiently applies solder paste or adhesive seamlessly to assembling chip, fine-pitch and special components in a quick, fatigue free process.
SMDs LM901 handles are:
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
If you’d like more information first click below.
| Specs |
| placement rate: 300-600 SMDs per hour |
| Dimensions: 700 x 680 x 340 mm |
| Max. Board size: 550 x 310 mm |
| max. PCB size: 550 x 310 mm |
| max. placement area: 425 x 310 mm |
| Specs |
| placement rate: 300-600 SMDs per hour |
| Dimensions: 700 x 680 x 340 mm |
| Max. Board size: 550 x 310 mm |
| max. PCB size: 550 x 310 mm |
| max. placement area: 425 x 310 mm |
You can expect approximately 300-600 SMD placements per hour, depending on component size, board layout, and operator experience.
The LM901 supports PCBs up to 550 × 310 mm in size, with a usable placement area of 425 × 310 mm.
It supports PCB thickness from about 0.5 mm up to ~4 mm, allowing for both lightweight and moderately thick boards.
The LM901 can place fine-pitch devices, chips, SO / PLCC components, mini & micro MELFs, and other special components. It also supports solder paste or adhesive dispensing.
It is designed for fatigue-free use: features include a smooth guide for the assembly head, handrest, logical control layout, and a constant-force mechanism in the Z-axis to reduce strain.
Yes — upgrades include dispensers (solder paste or glue), optical support / camera systems, axis brakes, and locking for X/Y (or Z) for precise alignment.
Its dimensions are about 700 × 680 × 340 mm, making it compact enough for workbenches or lighter prototyping sections of a manufacturing line.
Best suited for prototyping, small-series production, or when flexibility and cost control are more important than high throughput. Limitations: slower than automated machines, more operator dependency, and placement speed varies with component mix and board complexity.