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The LM900 is a fatigue-free, cost-efficient manual assembly system ideal for prototyping and small-series production. Placing typically between 300 and 600 components per hour, all LM 900s come equipped with the FRITSCH rail system.
With ultimate precision, SMD’s are placed accurately due to the flexible feeder system. A wide range of feeders can be fixed and replaced as complete sets or kits.
SMDs LM900 handles are:
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| Specs: |
| Placement performance: 300-600 SMDs / hour |
| Dimensions: 700 x 680 x 340 mm |
| Max. Board size: 550 x 310 mm |
| Max. Placement area: 425 x 310 mm |
| PCB thickness: 0.5 mm to ~ 4 mm |
| Specs: |
| Placement performance: 300-600 SMDs / hour |
| Dimensions: 700 x 680 x 340 mm |
| Max. Board size: 550 x 310 mm |
| Max. Placement area: 425 x 310 mm |
| PCB thickness: 0.5 mm to ~ 4 mm |
The LM900 typically places between 300-600 SMD components per hour, depending on operator skill, board complexity, and component mix.
It supports PCBs up to 550 × 310 mm, with a usable placement area of 425 × 310 mm.
The system supports PCB thickness from about 0.5 mm up to ~4 mm, accommodating both thin and moderately thick boards.
Key ergonomic features include smooth-running FRITSCH rail (guide) systems, a hand-rest, and well-designed feeder layout that reduces fatigue during extended use.
The LM900 handles a wide variety of SMD shapes, including chips, fine-pitch devices, SO, PLCC, Mini & Micro Melfs. Its flexible feeder system allows swapping feeders in / sets of feeders to suit component types.
Its dimensions are approximately 700 × 680 × 340 mm, making it compact enough for small workbenches or laboratories.
Manual systems like LM900 offer lower upfront cost, high flexibility, and simpler maintenance. The downsides are lower throughput, greater dependence on operator speed and accuracy, and less automation for tasks like feeder selection or alignment.
Yes—the LM900 uses the FRITSCH rail feeder system. A wide variety of feeders can be fixed or swapped in complete sets or kits, which helps in configuring for different components and reduces changeover time.