Indium NC-SMQ®92J Solder Paste Leaded Solder Paste

NC-SMQ92J is available in leaded Sn63/Pb37 and other alloys such as Sn62/Pb36/Ag2 or Sn62.6/Pb37/Ag0.4. It commonly uses Type 4 powder mesh sizing, with Type-5 available too for finer pitch/stencil applications.

The metal-load for NC-SMQ92J ranges from around 85-92% by weight, depending on alloy and powder type (Type 3 vs Type 4). Higher metal load improves paste transfer efficiency, volume, and ultimately joint robustness.

Yes. It is halogen-free, classified as a “no-clean” flux, and has ROL0 flux type. It meets or exceeds ANSI/J-STD-004, J-STD-005, and Bellcore GR-78 criteria. The paste is designed to leave a benign, probe-testable residue that does not clog multi-point probes.

Typical recommended reflow profile for NC-SMQ92J (Sn63/Pb37) includes:

• Peak temperature = 210-230 °C (acceptable up to ~233 °C)
• Time above liquidus = 45-60 seconds (acceptable 30-100 seconds depending on application)
• Ramp-up from ambient to peak: about 0.5-1.0 °C/sec (recommended), up to ~2.5 °C/sec acceptable.

NC-SMQ92J offers strong initial tack strength, long-term stability (meaning good storage and post-print hold without slumping), excellent fine-pitch printing performance, and extended open time. Its stencil life (when stored/used under ideal humidity/temperature) is more than 12 hours under standard conditions.

Although NC-SMQ92J is a no-clean paste, all residues are benign and probe-testable. If cleaning is required, many commercial no-water or IPA-based stencil & residue cleaners are effective. Also, stencil underside wipes every 10-25 prints are a useful practice.

• Store at <10 °C (i.e. refrigerated) when unopened; shelf life ~ 6 months unopened.
• Allow paste to come to ambient temperature before use — often 1-2 hours depending on container size.
• Cartridges should be stored tip-down, jars properly sealed; label opening time to track usage.

Best applications:

• High-speed SMT lines with rapid print/placement cycles.
• Fine-pitch components where paste transfer & definition are critical.
• Environments with moderate humidity, where strong tack and humidity resistance matter.
  Limitations:
• Being a leaded paste (Sn63/Pb37), it may not be suitable for lead-free requirements or certain regulatory mandates.
• Sensitive to excessively high peak reflow temperatures (beyond recommended) — can cause issues like joint degradation or excessive intermetallic growth.
• Handling very large boards or extremely fine pitch (< Type-4) may require optimized stencil design or reducing aperture area to avoid bridging or solder balls.