Indium Corporation’s high-quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements. Pastes are available for printing, dipping, dispensing and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with our world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects.
Indium Corporation’s PicoShot® NC-5M jetting solder paste is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Inherently chemically-compatible with Indium8.9HF Solder Paste, PicoShot® NC-5M is optimised for long-term jetting. PicoShot® NC-5M provides exceptional jetting performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
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