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Home / Electronic Production Equipment / Accessories / Solder Paste / Indium PicoShot® NC-5 Jetting Solder Paste

Indium PicoShot® NC-5 Jetting Solder Paste

Indium Corporation’s high-quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements. Pastes are available for printing, dipping, dispensing and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with our world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium Corporation’s PicoShot® NC-5M jetting solder paste is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Inherently chemically-compatible with Indium8.9HF Solder Paste, PicoShot® NC-5M is optimised for long-term jetting. PicoShot® NC-5M provides exceptional jetting performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

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PicoShot NC-5M Jetting Paste_4 copy
Features
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Features

  • Increased speed
  • Constant Z-axis
  • Easily dispense on varying heights
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Virtual Demo

This product is available to view in our virtual demo.

Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.

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Technical Details

Specifications
Alloy Metal Load (% By Weight)
Name Composition T3 Printing T3 Dispense T4 Printing T4 Dispense
Sn63 Sn63/Pb37 90% & 90.25% 85% 89.5% 84%
SAC305 Sn62/Pb36/Ag2
SAC105 Sn62.6/Pb37/Ag0.4
Specifications
Alloy Metal Load (% By Weight)
Name Composition T3 Printing T3 Dispense T4 Printing T4 Dispense
Sn63 Sn63/Pb37 90% & 90.25% 85% 89.5% 84%
SAC305 Sn62/Pb36/Ag2
SAC105 Sn62.6/Pb37/Ag0.4

FAQs: Your Indium PicoShot® NC-5 Jetting Solder Paste Questions Answered

1. What is PicoShot NC-5M, and for which equipment / use-case is it designed?

PicoShot NC-5M is a no-clean, halogen-free solder paste optimized for Mycronic MY600 / MY700 jetting systems. It is a jetting solder paste (type 5 powder) engineered for fine, precise deposits via jetting rather than stencil printing.

2. What alloy and metal loading does PicoShot NC-5M use, and what are its powder type / specification?

The standard alloy is SAC305, type-5 powder (≈ 85 % metal by weight). This gives good paste flow / coalescence performance while maintaining fine feature capability.

3. What jetting & deposit performance can be expected (dot size, syringe life, etc.)?
  • Smallest dot volume: ~7.5 nl per dot at ~360 µm diameter.
  • Jetting life (in syringe) greater than 8 hours under normal usage.
  • Minimal satellite droplets and high positional (X,Y) accuracy.
4. What flux classification and environmental features does PicoShot NC-5M have?
  • The flux is “no-clean” and meets IPC J-STD-004B with Amendment 1, ROL0 requirements.
  • It’s halogen-free (meets relevant halogen limits per IEC / EN standards).
5. What reflow profile is recommended for using PicoShot NC-5M to achieve optimal results?

Recommended reflow parameters include:

  • Preheat ramp: ~1.8-2.2 °C/s
  • Peak temperature: ~235-245 °C
  • Time above liquidus: ~30-40 seconds
  • Total time from ambient to peak: ~2-3 minutes
    These ensure good soldering, avoid excessive flux burn-off, and promote proper powder coalescence to reduce defects like graping.
6. How should PicoShot NC-5M be stored, handled, and prepared for use?
  • Store refrigerated (preferably < -10 °C for unopened; 1-10 °C offers shorter shelf life).
  • Syringes should be stored tip-down; let paste come to ambient temperature before use (at least 2 hours).
  • Once opened / at room temperature, non-refrigerated syringes have a working or open-time limit (check datasheet).
7. What are the key quality / reliability benefits of using PicoShot NC-5M?
  • Unique oxidation barrier helps avoid graping (poor powder coalescence) during reflow.
  • Clear residue with minimal flow-out; residue is benign.
  • Reduces head-in-pillow (HIP) defects and reflow spatter compared to similar pastes.
8. What are limitations or special considerations when using a jetting paste like PicoShot NC-5M compared to conventional stencil pastes?
  • Because it’s designed for jetting, equipment must support precise jetting dispense (Mycronic MY series) and appropriate nozzle/ejectors.
  • Dot size volumes are small – for large paste volumes, stencil or dispensing may still be needed.
  • Ambient / syringe temperature control is more critical (viscosity, flow) than for printing paste.
  • Open time (syringe life, idle time) is good but not indefinite; consistent usage or purge routines are important to maintain jet performance.

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  • Indium8.9HF Lead-Free Solder Paste

    Indium8.9HF Lead-Free Solder Paste

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