Indium Corporation’s high-quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements. Pastes are available for printing, dipping, dispensing and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with our world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects.
Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:
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