Indium8.9HF Lead-Free Solder Paste

Indium8.9HF is formulated for high reflow temperatures (for SAC and Sn-Ag alloy systems), giving excellent stencil print transfer efficiency (even through small apertures ≤ 0.66 aspect ratio), low voiding (especially in BGA, CSP, QFN), good oxidation resistance, and probe-testable flux residue.

The standard offering is SAC-type (e.g. SAC305 or Indalloy®276 in some spec variants), with Type-4 powder (also Type-3 in some cases) and a typical metal content around ~88.5% by weight.

Yes, it is halogen-free per EN14582 test method. The flux classification is ROL0 (no-clean). The flux leaves clear, probe-testable residues.

Suggested parameters include:

• Ramp-up rate approx. 0.5-1.0 °C/sec (ambient to peak), with a broader acceptable range (up to ~2.5 °C/sec) depending on board design.
• Time Above Liquidus (TAL) around 45-60 seconds.
• Peak temperatures matching SAC melt profiles (e.g. ~230-250 °C depending on alloy), with good performance under longer reflow or high-temperature processes.

• Use electroformed and/or laser cut / electropolished stencils for best print definition.
• For fine-pitch components (20 mil pitch or finer), reduce stencil aperture area by ~5-15% (or use “home-plate” shaped apertures) to avoid bridging, mid-chip beading.
• Maintain good stencil under-wipe frequency (start with every ~5 prints), appropriate squeegee pressure, blade angles, and separation speed.

• Store below 10 °C in refrigeration to maximise shelf life (approx. 6 months unopened).
• Label opening time/ date; allow paste to reach ambient temperature before use (≈2 hours for large jars) to avoid inconsistent print characteristics.
• Cartridges stored tip-down; maintain proper seal.

• Lower void rates in BGAs, QFNs, and CSPs due to good wetting and optimized flux vehicle.
• High probe-testability reduces false test failures.
• Good oxidation resistance and stability against slump (hot or cold), leading to more consistent print and fewer defects related to solder merging or bridging.

• Because of its higher reflow temperature needs, components and board materials must tolerate the thermal profile.
• Open/idle time may be less forgiving under poor environmental control (high humidity, high temperature) — good stencil handling and printing practices needed.
• For ultra-fine pitch or extremely small apertures (especially below certain aspect ratios), optimization of aperture design required (e.g. reductions); performance in those cases may demand more process tuning.