IBL VAC745/765 Vacuum Vapor Phase Soldering Oven

The VAC745 / VAC765 combines vacuum with vapour phase soldering. This means the soldering takes place in a fully inert atmosphere plus a vacuum stage, which helps remove trapped air/gases and greatly reduces voids in solder joints. Components are exposed only to condensable vapour and vacuum, reducing overheating.

• VAC745 (batch or inline): supports maximum board sizes in batch mode up to 635 × 444 × 70 mm; inline up to ~ 630 × 400 × 55 mm.
• VAC765 (larger version): supports up to 635 × 644 × 70 mm in batch; inline about 630 × 400 × 55 mm.

• Medium agent fill: 40 kg for VAC745; 60 kg for VAC765.
• Heating capacity: ~ 10.4 kW for VAC745; ~ 13 kW for VAC765.
• Power consumption ~ 5.5-5.8 kW/h. Supply: 400/230 VAC, 50/60 Hz, main fuse ~ 32A “gL/C”.
• Water connection: ½-inch line, pressure ~ 2.5-5 bar, flow ~ 5-6 L/min depending on model.

• Features Intelligent Profiling System (IPS) for creating and saving temperature profiles.
• “Soft Vapour Temperature Control” (SVTC) ensures vapour temperature is tightly managed to avoid overshoot.
• Live temperature recording via IBL’s VP Control software; documentation and traceability (optional barcode function) are supported.
• Observation window into the process chamber; automatic medium filtering; fluid level checking; vacuum / pressure monitoring.

• Machine size depends on model (batch vs inline). For VAC745 batch: around 1,355 mm length; for inline versions: ~ 2,040 mm. Depth and height vary similarly between VAC745 / VAC765.
• Weight: VAC745 is ~ 1,030-1,200 kg; VAC765 slightly heavier (~ 1,200-1,450 kg) depending on configuration.
• Front height (loading/unloading): ~ 900-1,000 mm, so ergonomic access needs to be considered.

• Two-chamber design and an integrated heat exchanger help reduce fluid (vapour medium) consumption.
• Low energy consumption for their performance class (given vacuum + inert atmosphere + large chamber).
• Automatic medium filtering and level checking also help reduce waste and maintain consistent performance.

These machines are ideal for industries with highest quality and void-free solder demands, such as telecommunications, defence, aerospace, medical electronics. When solder joints need high reliability and minimal defects, especially under BGAs, LGAs, multi-layer boards, or where void minimisation is critical.

• Because of the vacuum + inert atmosphere, these machines are more complex and costly than basic vapour-phase or simple reflow ovens.
• The fluid medium is expensive, handling safety, maintenance, and filtering must be well managed.
• Throughput in inline or batch mode depends on proper load/unload handling; using inline mode increases footprint and infrastructure demand.
• For very tall assemblies, thick boards, or very large boards at full size, mechanical considerations (support, warpage) and thermal profiling are still important to avoid defects despite the advanced vapour & vacuum system.

As an authorised IBL partner, Hawker Richardson supplies the IBL VAC745/765 batch/inline vapor phase with vacuum across Australia and New Zealand. We provide on-site installation, training, servicing and technical support, with coverage spanning Melbourne, Sydney, Adelaide, Auckland, and Christchurch, and stock commonly used spare parts for fast servicing and minimal downtime.