IBL SV260 Vapor Phase Batch Soldering Oven

The SV260 is designed for small to medium volume production, prototyping, rework, and NPI (new product introduction). Its tabletop format and features make it ideal when high solder quality is required but throughput demands are moderate.

The maximum PCB dimensions supported are approximately 300 × 260 × 80 mm. This includes the board footprint (length × width) and component height. Boards taller than this may not fit safely.

The SV260 has a two-chamber vapour phase design, which reduces fluid (vapour medium) consumption and improves energy efficiency. The design helps in fluid recovery, lowers loss of vapour agent, and maintains stable process temperatures with lower overhead.

• It includes program memory for up to 10 soldering programs, allowing custom process profiles.
• It supports automatic/ time-controlled soldering cycles (“Solder Automatic”) so that the operator can load the board and let the machine run the process automatically.
• Live temperature monitoring is supported (without needing a high-temperature external profiler) plus options for external profiling.

• Power supply: 205-240 VAC, around 2.1-2.2 kW maximum heater capacity.
• Medium (vapour agent) filling: ≈ 3 kg is required.
• Water cooling line: ½-inch connection, 2.5-5 bar pressure, with around 0.5-1 l/min flow for cooling / heat exchanger etc.

The SV260 is relatively compact: approx. 770 mm width × 710 mm depth × 680 mm height, with weight ≈ 110 kg. It’s a bench-/table-top unit. Logistics for front loading and access to the process chamber should be planned.

• It includes an observation window into the soldering chamber so operators can visually check the process.
• Has a maintenance-free transport system (patented) that’s designed for low wear and reliable operation.
• Integrated cooling fan for board cooling post-solder.

• Throughput is modest because it’s a batch machine, not inline. For high volume continuous production, larger or inline vapour phase systems may be more efficient.
• Limited board size / component height (300 × 260 × 80 mm); very large or thick assemblies may not be accommodated.
• Medium agent consumption and heating power still need utilities (power, water) that support continuous use. For example, heating demand peaks and fluid-level monitoring are essential.
• Because it is a front-loading manual batch unit, operator involvement is required for loading/unloading; automation is less than with inline systems. Also, cooling and process steps must be carefully profiled to avoid thermal stress.