IBL CCS100 Inline Vapor Phase Soldering Reflow Oven

The CCS100 is a high-performance inline vapor phase soldering system designed for 24/7 operation, medium-to-high volume SMT production. It uses a multiple-carrier system for continuous throughput.

• It has patented Vapor Energy Control (VEC), which allows flexible and responsive profile control without moving the PCBs inside the vapor.
• Built-in industrial PC + 21.5-inch HMI touchscreen for monitoring, data logging, energy monitoring, user interface with password levels etc.

• Length: from 80 mm up to 1000 mm
• Width: 50-500 mm without mid-support, 100-500 mm with mid-support.
• Edge support thickness ~ 3 mm (up to 6 mm with Heavy Duty “HD” Option)

• Footprint: ~ 5,820 mm (Length) × 1,800 mm (Depth) × 1,670 mm (Height)
• Weight: ~ 2,000 kg
• Power supply: 400/230 VAC, 50/60 Hz, 3 phases + neutral + PE
• Connecting power rating: 9 kW, with max heating power ~ 7 kW, average consumption ~ 5.6 kW/h
• Water supply: ½”, 2.5-5 bar
• Exhaust: 2 × Ø150 mm connections

• The CCS100 has an efficient maintenance system including Galden fluid levelling and filtering systems to keep the working fluid clean.
• Modular multi-zone construction with upstream buffer and downstream cooling zone; bottom cooling after soldering helps protect the boards.
• Work piece carrier return transport; automatic lane width adjustment; transparent covers; HD option for heavier solder applications. All help reduce downtime.

• Supports permanent process data monitoring, energy monitoring, password-protected user levels.
• Optional interfaces such as IPC-Hermes for traceability across the manufacturing process.
• Signal light tower, emergency stop options, covers for operator safety.

• Requires a relatively large footprint and significant machine weight (≈ 2,000 kg), so floor space and structural support are important.
• The fluid (Galden) filling amount is significant (≈ 60 kg), so fluid handling, storage, and maintenance need to be considered.
• Initial cost is high due to advanced features (automatic loading/unloading, multiple carriers, traceability) and utility infrastructure (power, water, exhaust) must be adequate.
• For very small batch or prototype work, the throughput advantage may be less significant unless the machine is fully utilised.

• Since vapor phase soldering ensures that the board is heated only to the boiling point of the heat transfer medium, there is minimal risk of overheating or thermal damage. This yields excellent solder joints, reduced voids, good wetting.
• The movement-free vapor exposure (tank moves, not the PCBs) eliminates stress / shifting of thin boards or fragile components.
• Cooling zones and bottom cooling ensure controlled cooling which is gentler on solder joints and reduces mechanical stress.
• The advanced profiling and monitoring provide better control vs less sophisticated reflow ovens or manual rework.

As an authorised IBL partner, Hawker Richardson supplies the IBL CCS 100 vapor phase across Australia and New Zealand. We provide on-site installation, training, servicing and technical support, with coverage spanning Melbourne, Sydney, Adelaide, Auckland, and Christchurch, and stock commonly used spare parts for fast servicing and minimal downtime.