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The DFA JS460 is a bench top Vapour Phase system. Maximum product format is 460mm x 205mm. Ideal as an entry level solution with plug and play operation.
Soldering temperature ranges from 160 to 240 degrees centigrade.
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
If you’d like more information first click below.
| Soldering Chamber | Stainlesss steel |
| Features | Window for optical solder observation |
| Power Supply | Single phase power supply, 208-240VAC |
| Power Consumption | Low power consumption, max 1 kW/h |
| System Dimensions | 590 x 540 x 350mm (l x w x h) |
| Weight | 25kg |
| Soldering Chamber | Stainlesss steel |
| Features | Window for optical solder observation |
| Power Supply | Single phase power supply, 208-240VAC |
| Power Consumption | Low power consumption, max 1 kW/h |
| System Dimensions | 590 x 540 x 350mm (l x w x h) |
| Weight | 25kg |
The JS460 is a vapour-phase (also called condensation) reflow soldering machine. It uses a high-boiling, chemically inert liquid (such as Galden) which is heated until it vaporises. The board is introduced into the chamber; the vapor condenses on the board and components, transferring heat very evenly until the solder melts. Because the vapor temperature is fixed by the boiling point of the liquid, there is a physical cap on how hot the board can get—this largely prevents overheating.
According to specifications for a similarly sized machine (the “Just Solder 460” / JS460-like model) the maximum soldering format is roughly 460 × 205 × 100 mm (L × W × H).
Yes — the JS460 (and machines of this type) are well suited for prototypes, small batches, laboratory use and even rework. The specification sheet for a similar “Just Solder 460” states it is ideal for “controlling prototypes & small quantities” with professional results.
For rework: Because vapour-phase is gentle and provides uniform heating, it can be advantageous when delamination, thermal stress or delicate components make conventional methods risky. Some vendors mention unsoldering via plates/fixtures in vapour phase.