IBL Minilab Vapor Phase Batch Soldering Oven

The Minilab supports PCBs up to 304 × 274 × 80 mm (approximately 300 × 275 × 80 mm) in size. This includes boards with fairly tall components, making it suitable for prototyping and mini-series.

It operates on 230 VAC, 50/60 Hz. Maximum heating capacity is 1.8 kW, with an average / typical power consumption of around 0.8 kW/h.

The Minilab is a compact, tabletop / bench-top unit. Overall dimensions are about 730 mm (length) × 600 mm (depth) × 600 mm (height). It weighs in at 70 kg.

• It has an integrated heat exchanger to minimise liquid drag-out (i.e. reduce loss of vapour agent and energy waste).
• There is a variable energy set-up (energy management system), meaning the user can adjust energy usage to match the job which helps reduce waste.
• Also includes an automatic fluid level indicator so usage is monitored.

The operating cycle is fully automatic once the board is loaded. It includes features like “solder automatic” (automated soldering cycle), automatic maintenance of medium-level check, and observation window so operators can monitor the process.

• The medium (vapour agent) filling is about 3 kg.
• Water connection: ½-inch line, supply pressure between 2.5-5 bar, with ~ 1 litre per minute usage.
• The main fuse requirement is 16A (“gL” or “C”).

The Minilab is ideal for development, prototyping, rework, and mini-series production. It’s intended for lower volume use, lab / test environments, and where footprint, cost, and flexibility are more important than raw throughput. It is not intended for large inline, high-volume continuous production.

• Lower throughput: as a batch and tabletop unit, the loading/unloading is manual and cycle times are more limited than inline systems.
• Limited maximum board size and weight compared to large inline / industrial-scale vapour phase ovens. Boards larger than ~ 300 × 275 mm or thicker/taller than 80 mm won’t fit.
• Need for monitoring and maintaining the vapour medium agent (filling, level, cleanliness) and heat exchanger to avoid defects or contamination.
• Cooling and thermal profile control are less flexible than in larger, more complex machines; for some sensitive components or high density boards, profiling and testing will be required to avoid thermal stress.