Heller Industries 1826 MK5 Series Convection Reflow Soldering Oven

The Heller 1826 MK5 can achieve belt speeds up to 74 inches per minute (≈ 188 cm/min) under both air and nitrogen configurations. This high speed helps the oven keep up with fast pick-and-place machines and supports high volume output.

It accommodates PCBs up to 22 inches (≈ 56 cm) wide as standard. Minimum board widths start at about 2 inches (≈ 5 cm). Optionally, with some configurations, up to 24 inches (≈ 61 cm) width may be possible.

The 1826 MK5 features 8 top & 8 bottom forced-convection heated zones, plus 2 standard cooling zones. The heated tunnel length (the portion where heat zones are active) is about 260 cm (~ 102 inches).

• Standard electrical supply: 3-phase, 480 VAC. Optional inputs of 208/240/380/400/415/440 VAC are available.
• Breaker size for the standard configuration is 100 A @ 480 V. Continuous power input ranges between ~ 6.6 to 14 kW, depending on board load and whether nitrogen or air mode is used.

Temperature is tightly controlled: accuracy of the temperature controller is approximately ±0.1°C. Cross-belt temperature uniformity (top vs bottom) is typically within ±2.0°C under standard operation. This ensures consistent soldering and minimizes defects.

• The oven uses Heller’s Balanced Flow Heater Module (BFM) technology to reduce nitrogen usage by up to 50% when using inert atmospheres.
• “Low KW” design features reduce electrical consumption by up to ~40% compared to older or standard ovens.
• Flux Separation System: collects flux in jars or collection boxes, which helps reduce maintenance downtime and keep the tunnel cleaner.

The standard temperature range is 60-350°C. There is an optional “high-temperature” mode that can extend up to 450°C if required.

• Size & footprint: The oven is large (≈ 465 cm / 183″ long by ~157 cm / 62″ wide by ~160 cm / 63″ high) and heavy (≈ 1970-2060 kg depending on configuration). You’ll need sufficient floor space and structural support.
• Warm-up times: Because of the number of heater zones and thermal mass, cold start warm-ups can take significant time; planning is needed for start-of-day throughput.
• Nitrogen / inert atmosphere mode: to realize void reductions or special soldering processes, you’ll need adequate gas supply infrastructure and controls. Using nitrogen increases operating costs.
• Board loading / cooling: Very heavy or large boards may require support (e.g. centre supports) to avoid sag or misalignment; cooling zones need careful profiling to avoid thermal shock.