TWS 850 is a powerful and compact reflow and convection oven with one heating zone ideal to perform soldering operation for small to prototype size SMT manufacturing, to cure adhesive and pastes and to remove humidity from fine pitch parts prior to reflow using hot bake function.
Easy to use and with good performance, TWS 850 is a cheaper oven who allows to do solder operation in a really short time. Heating of the board is obtained by forced convection of hot air, a well-proven system. The electronic control system is designed to minimise power consumption. Even if is a small oven it is possible to obtain a great variety of thermal profiles where it can fulfil the most demanding requests.
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
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