TWS Batch Reflow Convection Oven – 220 VOLT 850

The TWS 850 is tailored for small-batch, prototype or lab-scale SMT production. It features a compact bench-style design with a single heating zone and convection forced-air system, making it ideal for soldering boards, curing adhesive/pastes and removing humidity from fine-pitch parts prior to reflow.

The oven supports PCBs up to approximately 330 mm length × 240 mm width. Component height clearance is around 120 mm above the grid.

It uses forced convection hot-air heating (horizontal airflow) and can reach maximum temperatures up to ~ 350 °C. The single-zone design incorporates full control of heater set-point and actual temperature via a touch-screen interface.

The TWS 850 features a touch-screen LCD control panel that displays set-point and actual temperatures for each phase. While it may not include extensive multi-zone programming, it allows development of a variety of thermal profiles to suit different solders, adhesives and baking operations.

Key installation specs: dimensions approximately 710 mm (L) × 640 mm (W) × 410 mm (H) and weight around 25–35 kg (depending on configuration). Power supply is 220-230 V AC with maximum power consumption around 4.5 kW.

The TWS 850 includes a “hot bake” mode which allows the operator to dry out moisture and volatile residues on fine-pitch boards or adhesive coatings before the solder reflow phase. This helps reduce solder voids, improves paste wetting and minimises defects caused by trapped moisture. The forced convection heating makes this possible in a short time.

While the TWS 850 offers a cost-effective and compact solution, it has just one heating zone rather than the multiple top/bottom zones of a full tunnel oven. This means less flexibility in zoning (preheat, soak, ramp, reflow, cooling) and potentially less uniformity on very large or high-mass boards. It’s perfect for prototyping or small runs, but for very high throughput or complex boards a multi-zone design may be preferred.

• Compact bench-top size, enabling placement in tighter spaces.
• Single-zone convection system reduces complexity and cost while still enabling effective soldering, adhesive cure or hot-bake operations.
• Touch-screen user interface and ability to vary thermal profiles provide flexibility for changing solder pastes, lead-free processes or new board designs.
• Low-cost entry point and lower power consumption (4.5 kW max) compared to larger tunnel ovens.