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Home / Electronic Production Equipment / AOI Rework Equipment / solder-paste-inspection-machine / Yamaha YSi-SP 3D Solder Paste Inspection Machine

Yamaha YSi-SP 3D Solder Paste Inspection Machine

The YSi-SP is Yamaha’s first solder paste inspection (SPI) machine. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs.

The YSi-SP handles various high-speed and high-accuracy solder paste inspections with a single head, including high-precision inspections employing a Yamaha-exclusive algorithm combining 2D and 3D-based measurements, and image resolution switch-over utilizing super-high resolution technology.

The YSi-SP can swiftly coordinate with other Yamaha machines, such as performing automatic setup changes, automatically adjusting solder misalignment, and automatically converting adhesive inspection data from the dispenser.

While offering Statistical Process Control (SPC) to perform a wide range of statistical processing, the YSi-SP can also be equipped with various optional features, including bonding inspection and foreign matter inspection.

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Yamaha YSi-SP 3D Solder Paste Inspection Machine
Features
Technical Details
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Features

  • “1-head solution” to perform various inspections with a single head
  • Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
  • SPI gives manufacturers the opportunity to identify solder joint defects at an early stage and solve the issue instantly
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Virtual Demo

This product is available to view in our virtual demo.

Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.

If you’d like more information first click below.

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Technical Details

Specifications
SPECIFICATIONS YSi-SP
Applicable PCB L510 × W460mm~L50 × W50mm (single lane spec) *No dual lane specification available.
Horizontal resolution (FOV size) 1)25µm / 12.5µm (approx. 50×50mm) 2)20µm / 10µm (approx. 40×40mm) 3)15µm / 7.5µm (approx. 30×30mm) *All are standard selection type.
Height resolution 1µm
Inspection items Solder paste printing quality (volume, height, area and misalignment)
Power supply Single-phase AC 200V–230V ±10%
Air supply source Airless specification
External dimension L904 × W1,080 × H1,478 mm
Weight 550 KG
Specifications
SPECIFICATIONS YSi-SP
Applicable PCB L510 × W460mm~L50 × W50mm (single lane spec) *No dual lane specification available.
Horizontal resolution (FOV size) 1)25µm / 12.5µm (approx. 50×50mm) 2)20µm / 10µm (approx. 40×40mm) 3)15µm / 7.5µm (approx. 30×30mm) *All are standard selection type.
Height resolution 1µm
Inspection items Solder paste printing quality (volume, height, area and misalignment)
Power supply Single-phase AC 200V–230V ±10%
Air supply source Airless specification
External dimension L904 × W1,080 × H1,478 mm
Weight 550 KG

FAQs: Your Yamaha YSi-SP 3D Solder Paste Inspection Machine Questions Answered

1. What inspection functions does the YSi-SP perform on solder paste?

The YSi-SP inspects solder paste for volume, height, area, and misalignment. It uses a combination of 2D and 3D measurements, with image resolution switch-over for high-accuracy inspection.

2. What PCB sizes and thicknesses are compatible with the YSi-SP?

It handles PCBs from 50 × 50 mm up to 510 × 460 mm (single-lane spec), with board thickness between 0.3 mm to 5.0 mm.

3. What are the resolution options and how do they impact inspection quality?

The machine offers selectable horizontal resolution modes:

  • 25 µm / 12.5 µm (≈ 50×50 mm)
  • 20 µm / 10 µm (≈ 40×40 mm)
  • 15 µm / 7.5 µm (≈ 30×30 mm)

All modes support high precision for small area inspections. Vertical (height) resolution is 1 µm.

4. How does YSi-SP integrate with other machines in the SMT line?

It supports automatic setup changes via upstream data (barcodes or PCB IDs), can feed back print misalignment metrics to the printer, convert dispenser coating inspection data, and also send “bad mark” data forward to downstream mounters. This reduces redundant checks and helps maintain consistent quality.

5. Is Statistical Process Control (SPC) supported, and how does it help?

Yes—the YSi-SP includes SPC capabilities to perform statistical analysis of measured paste volumes, heights, misalignment, etc. This helps manufacturers monitor quality trends and identify issues early.

6. What are the physical dimensions, weight, and power requirements?

The YSi-SP has dimensions of 904 × 1,080 × 1,478 mm (L×W×H), weighs about 550 kg, and runs on single-phase AC 200-230 V ±10%. It does not require an air supply (airless specification).

7. What optional features are available to adapt the YSi-SP for specific inspection needs?

Optional packages include bonding inspection, foreign matter inspection, image resolution switch-over, and dispensing-coating inspection conversion. These allow you to tailor the machine for special inspection tasks beyond standard paste metrics.

8. What benefit does using the YSi-SP bring compared to only printing visual inspection?

By using the YSi-SP, defects in solder printing (volume defects, misalignment, excessive or insufficient height) can be detected early—after paste printing but before component placement. This prevents downstream failures, reduces rework, improves yield, and helps ensure consistent solder joints. The machine’s high speed + high accuracy helps manufacturers catch issues without slowing line throughput significantly.

9. Does Hawker Richardson supply and support the Yamaha YSi-SP in Australia and New Zealand?

As an authorised Yamaha partner, Hawker Richardson supplies the Yamaha YSi-SP, a premium solder paste inspection machine, across Australia and New Zealand. We provide on-site installation, training, servicing and technical support, with coverage spanning Melbourne, Sydney, Adelaide, Auckland, and Christchurch, and stock commonly used spare parts for fast servicing and minimal downtime.

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    Saki 3D Solder Paste Inspection Machine

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