Saki’s inspection technology is used in the assembly of circuit boards for a broad spectrum of products, such as smart phones with micro-size parts, on-vehicles, industrial devices with tall parts, and power supply circuit integrated servers and much more. Today with component miniaturisation and design advancements, Saki SPI provides high precision inspection of very small components with increased inspection speed achieving non shadowed inspection on the component.
The high accuracy of Saki’s 3Si and 3Di series ensures accurate feedback and feed forward to printers and pick and place machines. Feedback and misalignment data from the SPI machine to the printer improves the quality and reliability of the solder paste printing process. The system further prevents print quality issues by monitoring cleaning cycles and promoting the printer to when the stencil needs cleaning.
Feeding the print position measurement data from the SPI machine to the pick and place machine enables placement positions to be adjusted to improve quality. While a bad board skip function alerts the pick and place machine not to place components on a bad board. These functions reduce component waste and increase efficiency. Using components placement measurement in the AOI machine enables adjustments to be made to placement positions for improved reliability and quality.
Saki corporation propriety technology and accurate M2m connection offers a smart factory solution that controls and improves production productivity for the entire factory.
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