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Home / Electronic Production Equipment / AOI Rework Equipment / solder-paste-inspection-machine / Saki 3D Solder Paste Inspection Machine

Saki 3D Solder Paste Inspection Machine

Saki’s inspection technology is used in the assembly of circuit boards for a broad spectrum of products, such as smart phones with micro-size parts, on-vehicles, industrial devices with tall parts, and power supply circuit integrated servers and much more. Today with component miniaturisation and design advancements, Saki SPI provides high precision inspection of very small components with increased inspection speed achieving non shadowed inspection on the component.

The high accuracy of Saki’s 3Si and 3Di series ensures accurate feedback and feed forward to printers and pick and place machines. Feedback and misalignment data from the SPI machine to the printer improves the quality and reliability of the solder paste printing process. The system further prevents print quality issues by monitoring cleaning cycles and promoting the printer to when the stencil needs cleaning.

Feeding the print position measurement data from the SPI machine to the pick and place machine enables placement positions to be adjusted to improve quality. While a bad board skip function alerts the pick and place machine not to place components on a bad board. These functions reduce component waste and increase efficiency. Using components placement measurement in the AOI machine enables adjustments to be made to placement positions for improved reliability and quality.
Saki corporation propriety technology and accurate M2m connection offers a smart factory solution that controls and improves production productivity for the entire factory.

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Saki 3D Solder Paste Inspection Machine
Features
Technical Details
Related Products

Features

  • Propriety hardware provides accurate measurements
  • Self diagnostic system
  • Optical unit
  • Side Cameras
  • Advanced software features
  • Remarkable speed
  • True height measurement
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Virtual Demo

This product is available to view in our virtual demo.

Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.

If you’d like more information first click below.

More information

Technical Details

Specifications
Dimensions L Single Lane L Dual Lane XL Single Lane
Model Name 3Si-LS2 3Si-LD2 3Si-ZS2
Size (W) x (D) x (H) (mm) 1040 x 1440 x 1500 1340 x 1440 x 1500,
Weight 900kg
Electric Power Single Phase – 200-240V+/-10%, 50/60Hz
Air Requirement 0,5MPa, 5L/min (ANR)
PCB Size (mm) – Single mode Dual mode –
(7Nm camera head) (7Nm camera head) 50 x 60 – 686 x 870 1.97 x 27,00 x 34.25
90 x 60 – 330 x 330 1.97 x 2.36 – 12.99 x 12.99 50 x 60 330 x 330 1.97 x 2.36 12.99 x 12.99 50 x 60 320 x 330 1.97 x 2.36 12.60 x 12.99
(12/18Nm camera head) 50 x 60 – 500 x 510, 1.97 x 2.36 – 19.68 x 20.07 (12/18 Nm camera head)
50 x 60 – 500 x 510, 1.97x 2.36 19.68×20.07 50×60 320×510 1.97×2.36 12.60 x 20.07
PCB Clearance Top: 40mm, 1.57in. Bottom: 60mm, 2.36in. Top: 40mm, 1.57in. Bottom: 50mm, 1.96in. Top: 40mm, 1.57in. Bottom: 60mm, 2.3in.
Specifications
Dimensions L Single Lane L Dual Lane XL Single Lane
Model Name 3Si-LS2 3Si-LD2 3Si-ZS2
Size (W) x (D) x (H) (mm) 1040 x 1440 x 1500 1340 x 1440 x 1500,
Weight 900kg
Electric Power Single Phase – 200-240V+/-10%, 50/60Hz
Air Requirement 0,5MPa, 5L/min (ANR)
PCB Size (mm) – Single mode Dual mode –
(7Nm camera head) (7Nm camera head) 50 x 60 – 686 x 870 1.97 x 27,00 x 34.25
90 x 60 – 330 x 330 1.97 x 2.36 – 12.99 x 12.99 50 x 60 330 x 330 1.97 x 2.36 12.99 x 12.99 50 x 60 320 x 330 1.97 x 2.36 12.60 x 12.99
(12/18Nm camera head) 50 x 60 – 500 x 510, 1.97 x 2.36 – 19.68 x 20.07 (12/18 Nm camera head)
50 x 60 – 500 x 510, 1.97x 2.36 19.68×20.07 50×60 320×510 1.97×2.36 12.60 x 20.07
PCB Clearance Top: 40mm, 1.57in. Bottom: 60mm, 2.36in. Top: 40mm, 1.57in. Bottom: 50mm, 1.96in. Top: 40mm, 1.57in. Bottom: 60mm, 2.3in.

FAQs: Your Saki 3D Solder Paste Inspection Machine Questions Answered

1. What board sizes and modes can the SAKI 3D SPI machine handle?

The machine supports PCBs from 50 × 60 mm in single-lane mode, up to 686 × 870 mm in dual-lane mode with the 7 Nm camera head. With larger camera heads (12/18 Nm), it supports boards up to 500 × 510 mm in single-lane.

2. What clearance (height) is available above and below the PCB for inspection?

It provides a top clearance of 40 mm and a bottom clearance of 60 mm in most modes. With dual-lane or other configurations, bottom clearance may be ~50 mm depending on setup.

3. What are the power and air requirements for the SAKI 3D SPI?

It uses single-phase power, 200-240 V ±10 %, 50/60 Hz, and requires air supply at about 0.5 MPa with ~5 L/min (ANR) flow.

4. What hardware and software features help improve inspection accuracy and reduce defects?

Features include proprietary measurement hardware, side cameras, true height (3D) measurement, self-diagnostic system, plus advanced software that provides feedback to printers (print alignment and misalignment data) and controls cleaning cycles.

5. How does the SPI machine integrate with printing and pick-and-place systems to reduce waste and improve quality?

The machine feeds print position measurement data back to the printer (feedback) and also informs pick-and-place machines whether a board is “bad” (bad board skip). These functions help reduce component waste and misplacement.

6. What are the physical dimensions and weight of the unit?

For the Single-Lane model (3Si-LS2), dimensions are about 1040 × 1440 × 1500 mm (W × D × H) and weight around 900 kg. Dual-Lane models are wider (~1340 mm) but same depth and height.

7. What is the speed / throughput like, and what contributes to “remarkable speed”?

While exact components-per-hour aren’t given on the page, speed is boosted by features such as side cameras, self-diagnostics, and true height measurement, which reduce inspection delays and minimize re-inspection. The hardware is optimised for very small, shadow-free measurements.

8. What board formats or use-cases is this SPI machine best suited for?

It’s ideal for applications involving fine-pitch components, designing for small micro-parts (smartphones, industrial devices with tight specs), where solder paste printing accuracy and repeatability are critical. Also useful in high-mix lines where consistent SPI feedback is needed to maintain print quality.

9. Does Hawker Richardson supply and support the Saki 3D SPI in Australia and New Zealand?

As an authorised Saki partner, Hawker Richardson supplies the Saki 3D SPI, a precision solder paste inspection machine, across Australia and New Zealand. We provide on-site installation, training, servicing and technical support, with coverage spanning Melbourne, Sydney, Adelaide, Auckland, and Christchurch, and stock commonly used spare parts for fast servicing and minimal downtime.

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