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Saki’s inspection technology is used in the assembly of circuit boards for a broad spectrum of products, such as smart phones with micro-size parts, on-vehicles, industrial devices with tall parts, and power supply circuit integrated servers and much more. Today with component miniaturisation and design advancements, Saki SPI provides high precision inspection of very small components with increased inspection speed achieving non shadowed inspection on the component.
The high accuracy of Saki’s 3Si and 3Di series ensures accurate feedback and feed forward to printers and pick and place machines. Feedback and misalignment data from the SPI machine to the printer improves the quality and reliability of the solder paste printing process. The system further prevents print quality issues by monitoring cleaning cycles and promoting the printer to when the stencil needs cleaning.
Feeding the print position measurement data from the SPI machine to the pick and place machine enables placement positions to be adjusted to improve quality. While a bad board skip function alerts the pick and place machine not to place components on a bad board. These functions reduce component waste and increase efficiency. Using components placement measurement in the AOI machine enables adjustments to be made to placement positions for improved reliability and quality.
Saki corporation propriety technology and accurate M2m connection offers a smart factory solution that controls and improves production productivity for the entire factory.
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
If you’d like more information first click below.
| Dimensions | L Single Lane | L Dual Lane | XL Single Lane | |||
| Model Name | 3Si-LS2 | 3Si-LD2 | 3Si-ZS2 | |||
| Size (W) x (D) x (H) (mm) | 1040 x 1440 x 1500 | 1340 x 1440 x 1500, | ||||
| Weight | 900kg | |||||
| Electric Power | Single Phase – 200-240V+/-10%, 50/60Hz | |||||
| Air Requirement | 0,5MPa, 5L/min (ANR) | |||||
| PCB Size (mm) | – | Single mode | Dual mode | – | ||
| (7Nm camera head) | (7Nm camera head) | 50 x 60 – 686 x 870 1.97 x 27,00 x 34.25 | ||||
| 90 x 60 – 330 x 330 1.97 x 2.36 – 12.99 x 12.99 | 50 x 60 330 x 330 1.97 x 2.36 12.99 x 12.99 | 50 x 60 320 x 330 1.97 x 2.36 12.60 x 12.99 | ||||
| (12/18Nm camera head) 50 x 60 – 500 x 510, 1.97 x 2.36 – 19.68 x 20.07 | (12/18 Nm camera head) | |||||
| 50 x 60 – 500 x 510, 1.97x 2.36 19.68×20.07 | 50×60 320×510 1.97×2.36 12.60 x 20.07 | |||||
| PCB Clearance | Top: 40mm, 1.57in. Bottom: 60mm, 2.36in. | Top: 40mm, 1.57in. Bottom: 50mm, 1.96in. | Top: 40mm, 1.57in. Bottom: 60mm, 2.3in. | |||
| Dimensions | L Single Lane | L Dual Lane | XL Single Lane | |||
| Model Name | 3Si-LS2 | 3Si-LD2 | 3Si-ZS2 | |||
| Size (W) x (D) x (H) (mm) | 1040 x 1440 x 1500 | 1340 x 1440 x 1500, | ||||
| Weight | 900kg | |||||
| Electric Power | Single Phase – 200-240V+/-10%, 50/60Hz | |||||
| Air Requirement | 0,5MPa, 5L/min (ANR) | |||||
| PCB Size (mm) | – | Single mode | Dual mode | – | ||
| (7Nm camera head) | (7Nm camera head) | 50 x 60 – 686 x 870 1.97 x 27,00 x 34.25 | ||||
| 90 x 60 – 330 x 330 1.97 x 2.36 – 12.99 x 12.99 | 50 x 60 330 x 330 1.97 x 2.36 12.99 x 12.99 | 50 x 60 320 x 330 1.97 x 2.36 12.60 x 12.99 | ||||
| (12/18Nm camera head) 50 x 60 – 500 x 510, 1.97 x 2.36 – 19.68 x 20.07 | (12/18 Nm camera head) | |||||
| 50 x 60 – 500 x 510, 1.97x 2.36 19.68×20.07 | 50×60 320×510 1.97×2.36 12.60 x 20.07 | |||||
| PCB Clearance | Top: 40mm, 1.57in. Bottom: 60mm, 2.36in. | Top: 40mm, 1.57in. Bottom: 50mm, 1.96in. | Top: 40mm, 1.57in. Bottom: 60mm, 2.3in. | |||
The machine supports PCBs from 50 × 60 mm in single-lane mode, up to 686 × 870 mm in dual-lane mode with the 7 Nm camera head. With larger camera heads (12/18 Nm), it supports boards up to 500 × 510 mm in single-lane.
It provides a top clearance of 40 mm and a bottom clearance of 60 mm in most modes. With dual-lane or other configurations, bottom clearance may be ~50 mm depending on setup.
It uses single-phase power, 200-240 V ±10 %, 50/60 Hz, and requires air supply at about 0.5 MPa with ~5 L/min (ANR) flow.
Features include proprietary measurement hardware, side cameras, true height (3D) measurement, self-diagnostic system, plus advanced software that provides feedback to printers (print alignment and misalignment data) and controls cleaning cycles.
The machine feeds print position measurement data back to the printer (feedback) and also informs pick-and-place machines whether a board is “bad” (bad board skip). These functions help reduce component waste and misplacement.
For the Single-Lane model (3Si-LS2), dimensions are about 1040 × 1440 × 1500 mm (W × D × H) and weight around 900 kg. Dual-Lane models are wider (~1340 mm) but same depth and height.
While exact components-per-hour aren’t given on the page, speed is boosted by features such as side cameras, self-diagnostics, and true height measurement, which reduce inspection delays and minimize re-inspection. The hardware is optimised for very small, shadow-free measurements.
It’s ideal for applications involving fine-pitch components, designing for small micro-parts (smartphones, industrial devices with tight specs), where solder paste printing accuracy and repeatability are critical. Also useful in high-mix lines where consistent SPI feedback is needed to maintain print quality.
As an authorised Saki partner, Hawker Richardson supplies the Saki 3D SPI, a precision solder paste inspection machine, across Australia and New Zealand. We provide on-site installation, training, servicing and technical support, with coverage spanning Melbourne, Sydney, Adelaide, Auckland, and Christchurch, and stock commonly used spare parts for fast servicing and minimal downtime.