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Call us Now
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Call us Now
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Call us Now
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Call us Now
1300 36 00 31
Call us Now
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Yamaha’s i-Pulse S10 is a 3D hybrid surface mounter offering all the benefits of a full-size system, in a compact, small footprint machine. Equipped with high feeder capacity and large board handling, the S10 is suited to single machine or modular line applications and a high capacity placement head.
The highly flexible Yamaha i-Pulse S10 is available with an innovative head system incorporating 6 spindles with a wide component handling range. The S10 utilises the same fast change feeder bank and tray handler capabilities as the M10 and has a feeder capacity of up to 90 feeder positions. The optional camera allows placement of parts down to 0.2 x 0.1 mm fulfilling the current demands on reduced component and ball sizes.
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
If you’d like more information first click below.
| S10 | |
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm |
| Board thickness | 0.4 – 4.8mm |
| Board flow direction | Left to right (Std) |
| Board transfer speed | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm |
| Placement angle | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor |
| Component height | Max 30mm*1Â (Pre-placed components: max 25mm) |
| Applicable components | 0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg |
| S10 | |
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm |
| Board thickness | 0.4 – 4.8mm |
| Board flow direction | Left to right (Std) |
| Board transfer speed | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm |
| Placement angle | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor |
| Component height | Max 30mm*1Â (Pre-placed components: max 25mm) |
| Applicable components | 0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg |
