VP-MINI Vapour Phase Machine

The VP-MINI supports solder assemblies up to 240 × 170 × 20 mm (Length × Width × Height). Ideal for lab, prototype, and small-batch work.

It is well suited for complex component types including BGAs, flip-chips, QFPs and hybrids, delivering defect-free soldering.

A full standard cycle is about 10 minutes, with the soldering (immersion) phase lasting 60-120 seconds, depending on the PCB and component mass.

Process temperature ranges between 210 – 240 °C, depending on which vapour medium is used (e.g. Galden).

The machine uses single-phase 220-240 V / 50-60 Hz power (~1,000 W / about 5 A). Its external dimensions are approx. 400 × 315 × 305 mm, and it weighs about 6 kg.

The condensation (vapour phase) method ensures homogeneous temperature transmission across the assembly. Because components are heated via vapour’s boiling point, there’s no risk of local overheating above the medium’s set temperature.

The unit uses forced-air cooling after the reflow/soldering stage, allowing safe cooling of components without thermal shock.

While excellent for prototypes and small batch work, limitations include smaller maximum board size, lower throughput per hour, and the manual/bench-top loading method which means less automation. Also, cycle time (≈10 min) is longer than some rapid inline systems.