DFA VP-JUMBO Vapour Phase Machine

The VP-JUMBO is designed for lab, prototyping, and small production use; it handles single pieces or small quantities of PCBs. It’s suitable for QFPs, BGAs, Flip-Chips, hybrids, and other densely-populated assemblies.

The largest PCB size it supports is 430 × 230 mm, with a maximum board height (thickness) of 20 mm.

It runs off single-phase 220-240 V (50-60 Hz), drawing about 1,500 W (≈ 8 A). System dimensions are 605 × 375 × 305 mm (L × W × H).

Standard cycle time is approximately 15 minutes. The actual soldering (vapour immersion) time varies between 60 and 120 seconds based on PCB size, component type, and thermal mass.

Depending on the vapour medium (Galden or similar), the process temperature ranges from 210 °C up to 240 °C.

Heat is transmitted by vapour condensation, giving homogeneous and gentle heating. Components are not overheated due to the nature of the vapour phase — the temperature is limited by the boiling point of the vapour medium. Oxygen-free environment helps further to avoid oxidation.

The VP-JUMBO uses forced-air cooling after the reflow stage. The heat transfer medium (Galden) must be filled (about 500-800 ml) and maintained. Regular replacement or maintenance of vapour medium and ensuring the chamber is clean are needed to maintain process consistency.

Best suited for prototyping, R&D, small batch production, or where high thermal uniformity and component safety (BGAs, Flip-Chips) are critical. Limitations include relatively low throughput compared to convection reflow ovens, cycle times that may be long for large boards, and dependency on correct vapour medium and setup to achieve process repeatability.