Reflow Thermal Profiling

The SolderStar PRO is an ultra-compact data logging system designed for measuring and documenting thermal profiles in soldering processes such as reflow, wave/selective, and vapor phase soldering. It captures temperature data via multiple channels (thermocouples) and helps ensure quality, reduce defects, and meet audit/ISO requirements.

The profiler supports 6, 9, 12, or 16 Type-K thermocouple channels. It is upgradable via changing the “Thermocouple Adapter,” allowing scaling up channel count in the field.

• Temperature measurement range: −150 °C to +600 °C
• Sampling interval: from 0.1 seconds to 10 minutes
• Accuracy: ± 0.5 °C, with a resolution of ± 0.02 °C

The compact logger unit measures about 125 × 52 × 9 mm and weighs 110 grams. Its slim profile (with low height) makes it suitable to pass through ovens with low tunnel heights and narrow electronic assemblies.

The device has memory for 120,000 data points, sufficient for long profiling runs across many zones and for archiving profile data without needing immediate download.

It offers communications via USB (Type A – Mini B) or via 2.4 GHz wireless link. Additionally the profiler docks into a protective heat shield + thermocouple adapter. The “SmartLink” connector system simplifies quick connections with accessories.

The internal logger unit has a maximum internal temperature rating of +85 °C, beyond which it auto-shuts down to protect itself. This protects the electronics during high-temperature reflow or vapor phase processes.

Benefits include:

• Improved solder joint quality and reduced defects due to better control of temperature zones.
• Reduced energy consumption by optimizing heating profiles.
• Lower rework costs and stronger process validation for audits / ISO documentation.
• Trade-offs / considerations:
  • Requires correct placement of thermocouples on representative boards to get reliable data.
  • Profiling adds a step to the production process; processes must allow for intermittent profiling without disrupting throughput.
  • Initial investment plus training for operators to interpret profiles effectively.