IBL BLC Series Batch/Inline Vapor Phase Soldering Reflow Oven

The BLC Series supports maximum board (PCB) sizes up to about 450 × 540 × 80 mm in the batch mode, and up to 630 × 400 × 65 mm in inline mode (depending on the model).

Vapor phase uses a boiling heat transfer medium (“medium agent”) whose vapor condenses on the PCB, delivering uniform and very controlled heat. The BLC Series includes patented Soft Vapor Temperature Control (SVTC) plus features like Intelligent Profiling System (IPS) to prevent overheating of components and to deliver repeatable solder profiles.

Depending on the model, the machine has a work-carrier loading capacity (carrier size) up to 7 kg. The inline variants allow for continuous flow, while batch variants are manually or semi-automatically loaded.

• Vapor medium filling: between 16-25 kg depending on model size.
• Max heating capacity of vapor heater varies: e.g. ~ 6.4-10.4 kW in larger models.
• Power consumption (average) is around 2.6-3.6 kW/h, again depending on model.
• Water connection required (½”, 2.5-5 bar), for cooling/condensation or heat exchanger functions.

• Transport / carrier handling is “cool handling” design: all moving parts are outside the process chamber, reducing wear and heat exposure.
• Integrated automatic fluid filter system to keep the heat-transfer medium clean.
• Observation window into the process chamber, so processes can be visually monitored.

• Built-in IBL software (VP-Control) for live temperature monitoring, traceability and documentation, optionally with barcode functionality.
• Program memory support (many solder profiles), support for both lead-free and leaded soldering in a single machine.
• Intelligent Profiling System for easy profile setup. Also optional features like extra measurement channels for board temp measurements.

• Rapid Cooling System (RCS) for boards/components sensitive to heat.
• IR pre-heating, additional cooling or heating fans, multi-level mode (for boards of different heights), exhaust enhancements, barcode systems for automation and traceability.

• Although the footprint is relatively compact for the capacity, the size and weight of larger models (especially inline) impose infrastructure demands (space, floor strength, water supply, ventilation).
• Cycle times in batch mode are lower throughput than inline; for high continuous volumes inline mode is preferred.
• Upfront cost and cost of the vapor medium (agent), filters, and regular maintenance must be factored in for TCO.
• For boards with extreme thermal mass or very tall components, profiling is critical; incorrect profiles can still lead to defects or warpage even with advanced features.

As an authorised IBL partner, Hawker Richardson supplies the BLC series batch/inline reflow vapor phase soldering systems across Australia and New Zealand. We provide on-site installation, training, servicing and technical support, with coverage spanning Melbourne, Sydney, Adelaide, Auckland, and Christchurch, and stock commonly used spare parts for fast servicing and minimal downtime.