Aqueous Technologies Misprint Cleaning Machine

It is designed to clean misprinted circuit boards and assemblies, and stencils/screens with un-reflowed solder paste. The goal is to remove misprints without damaging delicate parts and to avoid defects caused by solder paste that wasn’t properly printed.

The machine uses ultrasonic energy (around 40 kHz) with a sweep generator that oscillates between ~37 kHz and ~43 kHz. This pulls solder paste off the board rather than forcing it (which helps prevent redeposition of solder spheres under components).

Yes. Because of the variable sweep between frequencies and its fairly gentle average sound-energy level, it minimises the chance of damage to delicate wire bonds and components while still effectively cleaning.

It can handle full immersion of boards or stencils up to 29″ × 29″ (≈ 736.6 mm × 736.6 mm).

The wash cycle is programmable via a digital timer, with the timer able to be set from 1 to 99 minutes for the wash process. Many misprint jobs can be cleaned in under five minutes, depending on how much solder paste is on the board.

• Tank capacity: about 133 litres.
• It has an adjustable misprint rack to support different board sizes and ensure correct immersion.
• Comes standard with a hand-held rinse wand and air knife for drying / removing moisture after rinse.

The machine’s dimensions: 30″ D × 55″ W × 45″ H, and weight approximately 600 lbs.

• Low operational cost due to ultrasonic cleaning process (often less chemical or aggressive washing needed).
• Reduced risk of damage and reduced rework, because the paste is pulled off gently rather than being forced.
• Smaller footprint than many full chemical defluxing or stencil wash systems, making it easier to integrate in SMT production lines.