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Solution

Spotlight on Ovens for SMT Production

Ovens are a vital part of the production process for SMT production so we know how important it is to invest in the right solution for your business and your boards.

Whether you are just starting out and looking for an oven with a small footprint, or looking for a full inline solution, we have a selection of ovens to choose from. Offering both convection and vapour phase ovens, Hawker Richardson works with a range of leading suppliers to ensure we cater for your needs, whether you need to focus on optimal throughput or achieve maximum quality with boards for critical applications.

Frequently asked questions (FAQs)

1) Convection or Vapour Phase?

Whether you choose convection or a vapour phase oven, it depends completely on your application and the specifics of your requirements. This can include (but is not limited to): board size, board components, type of paste, throughput, and accuracy.

2) Is it worth investing in additional zones?

We always recommend you consider both your immediate requirements and the boards / projects you may have in the future.  If you have the budget, it is worth investing in an oven with slightly more capabilities to future-proof the asset.

3) What is CBS and why do I need it ?

CBS or Center Board Support will prevent wide or heavy PCBs from sagging during reflow. During a lead-free process, the temperatures are slightly higher than on a traditional leaded profile.  Given that glass transition point of most FR4 material is around 130 degrees Celsius, this can cause issues on PCBs. With minimal copper between the layers, especially on thinner PCBs, this can lead to sagging of the PCB This can be an issue when doing a second pass through the printer as the FR4 will hold the shape of a sagged PCB.

The CBS system is controlled via the individual programs on the machine and can be set to be up or down depending on PCB width/weight complexity. One thing to remember when using the CBS is that you will need to consider having a clear strip down the centre of the PCB for double sided PCBs where you may have components mounted on the bottom side already.

4) Should I choose a Convection or Vapour Phase Reflow system?

Choosing between vapour phase reflow and convection is not an easy choice to make. We have tried to name a few reason why you might choose one over the other. Vapour phase ovens and Convection, as you can see, come in Benchtop/Standalone and inline formats. The choice and reason to choose one over the other is detailed here:

  • Low volume/High end: Defence/Space work – An IBL Vapour Phase would be the choice
  • Low volume/Low cost work –  Small Vapour Phase benchtop would be a good solution
  • Minimal to zero voiding required on high end work, look at a Vapour Phase or a Vacuum Vapour Phase system
  • Mid volume production on a budget, a small inline convection would be a good choice
  • High volume production with 2-3 Pick & Place machines in the line, a Heller 1809-1913 Lead free convection reflow would be oven of choice
  • High volume, high end product, again with high speed mounters, consider a Voidless Convection oven for ultimate low voiding

Convection Oven – Benchtop convection (Low volume/Prototype)

TWS Batch Reflow Convection Oven – 220 VOLT 850

  • Small footprint.
  • Solder boards up to 330 mm length and 240 mm width.
  • Display of set point & actual temperature for each heating phase.

 

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Spotlight on Ovens for SMT Production

Convection Oven – Benchtop convection (Low volume/Prototype)

MRO160 and 250 reflow soldering

  • Max. PCB size: 200 x 160 mm.
  • Enables users to start prototyping with low investment .
  • Easy operation. Start production after following only a few steps.

 

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Spotlight on Ovens for SMT Production

Convection Oven – Benchtop convection (Low volume/Prototype)

TWS 1320 Evo Convection Oven

  • Boards up to 400mm in width.
  • Capable of lead-free application.
  • Four heating and one cooling zone.

 

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Spotlight on Ovens for SMT Production

Inline convection (mid-volume)

Essemtec RO300FC Convection Reflow Soldering SMT Oven

  • The RO300FC-N2 can be operated with air or nitrogen.
  • The changeover takes less than five minutes.
  • Maximum reflow width 300 mm.
  • Program capacity 49 (10 preset standard, 10 preset leadfree, 10 preset curing, 19 free).

 

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Spotlight on Ovens for SMT Production

Inline convection (mid-volume)

Essemtec RO300FC Convection Reflow Soldering Oven

  • Maximum reflow width 400 mm (15.8″).
  • Reliable soldering results for standard and unleaded use.
  • The convection technology uses vertical laminar flow, which offers an efficient heat transfer with the lowest Delta T values.

 

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Spotlight on Ovens for SMT Production

Inline convection (mid-volume)

TWS 1385 Evo Convection Reflow Soldering Oven With Mesh Conveyor

  • Conveyor width 400 mm.
  • Heating & cooling zones: four heating, one cooling.
  • Air temperature is controlled by a microprocessor through K-type thermocouples placed in each zone, keeping temperatures between tight limits.
  • “PID” algorithm to ensure a faster temperature adjustment in the four zones.

 

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Spotlight on Ovens for SMT Production

Vacuum Convection Reflow (Inline)

1809 MK5 – Heller Advanced In-Line Void less / Vacuum Reflow Soldering Oven

  • 9 Top And Bottom Heated Zones – highest zone count per linear foot in the industry!
  • 2 Internal Cooling Zones – gives lowest exit temperature!
  • NEW Module Design with 10″ modules gives the flexibility to subdivide the profile into smaller segments and allows for more refined “profile sculpting”. The only way to satisfy demanding Lead Free Applications!
  • Nitrogen Inert Atmosphere To 10 PPM with 50% reduction in N2 consumption!

 

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Spotlight on Ovens for SMT Production

Convection Reflow (High Volume)

Heller Industries 1707MK5 Series Convection Reflow Soldering Oven 

  • Minimum/Maximum Board Width 2″ – 22″ (5 – 56 cm) 24” (61cm) Optional.
  • Seven heat zones and one cooling zone.
  • Supports high mix / medium volume throughput at speeds up to 24 inches (60 centimetres) per minute.

 

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Spotlight on Ovens for SMT Production

Convection Reflow (High Volume)

Heller Industries 1809MK5 Series Convection Reflow Soldering Oven

  • Accommodates the fastest pick and place systems and delivers the highest levels of repeatability with the lowest delta Ts.
  • Maximum PCB Width 22″ (56 cm).
  • The 1809 Mark5 comes with 9 zones.

 

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Spotlight on Ovens for SMT Production

Convection Reflow (High Volume)

Heller Industries 1913 MK5 Reflow Soldering Oven

  • Nine top and bottom heated zones – highest zone count per linear foot in the industry
  • Two internal cooling zones gives the lowest exit temperature
  • With Heller’s Balanced Flow Heater Module (BFM) technology, the cost of running nitrogen has been reduced by up to 50%!
  • With LOW KW features, electrical consumption can be reduced by up to 40%!

 

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Spotlight on Ovens for SMT Production

Vapour Phase Ovens – Benchtop Vapour phase (Low volume/Prototype)

DFA VP-JUMBO Vapour Phase Machine

  • Max PCB Size 430 x 230 x 20mm.
  • Table model top loader, ideal for prototyping.
  • Suitable for BGA’s, stacked packages.

 

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Spotlight on Ovens for SMT Production

Vapour Phase Ovens – Benchtop Vapour phase (Low volume/Prototype)

IBL Minilab Vapour Phase Batch Soldering Oven

  • Board sizes up to 300 x 275 x 80 mm.
  • Low energy and fluid consumption with integrated heat exchanger.
  • Maintenance-free transport system (patented).

 

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Spotlight on Ovens for SMT Production

Vapour Phase Ovens – Benchtop Vapour phase (Low volume/Prototype)

IBL SV260 Vapour Phase Batch Soldering Oven

  • Board size up to 300 x 260 x 80 mm.
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger.
  • Live temperature monitoring without high temperature profiler.

 

 

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Spotlight on Ovens for SMT Production

Stand Alone Vapour Phase (mid-volume)

IBL SV540 Series Vapour Phase Batch Soldering Oven 

  • Board sizes up to 560 x 360 x 80 mm.
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchange.
  • TE-Option with 2 temperature-measuring channels for thermal profile monitoring and recording.

 

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Spotlight on Ovens for SMT Production

Stand Alone Vapour Phase (mid-volume)

IBL BLC Series Batch/Inline Vapour Phase Soldering Reflow Oven

  • Available as batch or inline.
  • Live temperature monitoring with IBL Software (VP- Control) without profiler
  • Traceability and documentation with IBL Software (VP-Control), optionally with barcode function
  • Carrier sizes from 300 x 340 x 80 mm up to 840 x 540 x 80 mm.

 

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Spotlight on Ovens for SMT Production

Vacuum Vapour Phase Reflow (Inline or standalone)

IBL VAC745/765 Vacuum Vapour Phase Soldering Oven

  • Different machine types with carrier sizes from 635 x 440 x 70 mm up to 635 x 644 x 70 mm.
  • Vacuum system in steam (patented) with low process temperature.
  • Create a solder profile in one step with the Intelligent Profiling System (IPS).

 

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Spotlight on Ovens for SMT Production

Vapour Phase (High volume)

IBL CX600/CX800 Series Inline Vapour Phase Soldering Reflow Oven

  • Carrier sizes from 680 x 650 x 80 mm up to 825 x 650 x 80 mm
  • Vapour Phase Inline System for high volume throughput
  • Loading and Unloading conveyors with buffer function
  • Three internal process chambers with automatic airlocks
  • Highest precision and process quality with patented Soft Vapour Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Live temperature monitoring with IBL Software without profiler
  • Traceability and documentation with IBL Software

 

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Spotlight on Ovens for SMT Production

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