Unicomp AX-8200 PCB X-Ray Inspection Machine

The AX-8200 is intended for high-resolution imaging in electronics manufacturing—ideal for BGA (Ball Grid Array), CSP (Chip Scale Package), QFN, Flip Chip, COB, and a broad range of SMT components. It supports process development, monitoring, rework verification, and defect detection under solder joints, etc.

It uses a sealed tube X-ray source with a maximum voltage of about 90 kV (sometimes spec’d up to 100 kV) and a micro-focus spot size of 5 µm. This allows fine detail imaging such as solder voids.

The system supports up to 600× magnification. The maximum loading area is about 510 mm × 420 mm, and the maximum detection (inspection) area is approximately 435 mm × 385 mm.

It allows ± 60° tilting of the X-ray axis / tube or detector (i.e. oblique views), which helps in inspecting angled or hidden solder joints, voids under BGAs, etc.

The AX-8200 has overall dimensions roughly 1080 mm × 1180 mm × 1730 mm (L × W × H) and weighs in the vicinity of 1,050-1,150 kg. It operates on AC 110-220V / 220V power (50/60Hz) with power consumption under about 1.0 kW.

It features standard radiation safety measures, including sealed tube design, electromagnetic interlock, warning lights, automatic shut-off, and its X-ray leakage is less than 1 µSv/h, complying with international cabinet X-ray safety standards.

The AX-8200 includes tools such as automatic BGA void measurement, area/void ratio reporting, DXI image-processing, programmed X/Y table motion for multiple image routines, auxiliary measurement tools (distance, angle, diameter, polygon etc.). It also supports report generation.

• While it offers high magnification and detailed imaging, very small or ultra-fine features may still approach the limit of detectability given the 5 µm spot size.
• Oblique / tilting inspection adds setup and alignment complexity; also slightly reduces throughput compared to straight top-down imaging.
• Physical size, weight, and cost are considerable; facility must accommodate size, power, and safety infrastructure.
• The inspection area is large, but for very large multi-panel or fixture-based assemblies beyond its load/detection area, multiple scans or alternative configurations may be needed.