Scienscope Xspection 3120 offline X-ray Inspection system

The Scienscope X-Spection 3120 is used for offline X-ray inspection of printed circuit boards (PCBs), especially long or oversized boards. It helps manufacturers detect internal defects such as voids, solder joint failures, misalignment, and hidden component issues without damaging the product.

Yes. The X-Spection 3120 is designed specifically for X-ray inspection of long PCBs up to 1.2 metres. This makes it an ideal solution for industries producing large electronic assemblies where standard X-ray systems may not accommodate board length.

An offline X-ray inspection system like the X-Spection 3120 can detect:

• Voids in solder joints
• BGA and QFN solder defects
• Misaligned components
• Cracked connections
• Hidden internal failures
• Insufficient solder or bridging

2.5D X-ray inspection combines high-resolution 2D imaging with enhanced depth and angled viewing. This allows operators to analyse solder joints and internal structures more clearly than standard 2D systems.

The X-Spection 3120 is ideal for high-reliability industries such as:

• Automotive electronics
• EV battery control systems
• Aerospace and defence
• Medical device manufacturing
• Telecommunications and industrial controls

Yes. The system is highly effective for BGA X-ray inspection, allowing manufacturers to view hidden solder joints beneath the package and detect voiding, bridging, and incomplete connections.

The X-Spection 3120 can be configured with either:

• 90kV for standard PCB and solder joint inspection
• 130kV closed-tube technology for thicker assemblies and higher-density components

Higher voltage improves penetration for more complex boards.

Scienscope XSpection 3120 Offline X-ray inspection offers advantages for complex applications, including:

• Inspection of hidden solder joints (BGA/QFN)
• Higher flexibility for prototypes and fault analysis
• Ideal for large or non-standard PCB formats
• Reduced cost compared to fully inline AXI systems