Saki Inline 3D-CT AXI – 3Xi-M110 PCB X-ray Inspection System

• The 3Xi-M110 supports PCBs with widths from 50 mm up to 360 mm, and lengths up to 510 mm (depending on configuration).
• For thickness, it handles PCBs between 0.8 mm to 4.0 mm including warpage of up to ~ 2 mm.

The 3d x ray inspection system delivers resolution in the range of approximately 10 µm to 30 µm using standard detectors, and optional wide-image flat panel detectors may allow better resolution or less field-of-view trade-offs.

It is designed for detecting a full spectrum of solder defects including voids, head-in-pillow (HiP), PTH (through-hole) solder issues, excessive or deficient fillets, shorts & bridges, misalignment, etc. The Planar CT (3D volumetric) imaging allows separating layers and detecting hidden defects.

Planar CT captures multiple projection images from different angles, reconstructs high-definition cross-section (“slice”) images, then stacks or composes them to a full 3D volumetric model. This allows better Z-axis separation (top-side vs bottom-side), clearer edges under components, and fewer false negatives due to shadows or overlapping features.

Throughput is improved via:

• Use of wider detectors (optional) to reduce number of fields-of-view (FOVs) per board.
• New/improved software & control algorithms allow simultaneous stage control, image capture and CT reconstruction.
• Updated versions (e.g. V3) show cycle-time reductions up to ~ 50%.

• Dimensions: ~ 1380 mm (W) × 2150 mm (D) × 1500 mm (H) (approx) for main body.
• Weight: about 3,100 kg.
• Power: three-phase ~ 200 V ±10%, 50/60 Hz, around 4.2 kVA.
• Environmental: Operating temperature ~ 15-30°C, humidity non-condensing, requires air supply (~0.5 MPa) and some cooling.

• Closed sealed X-ray source with leakage < 0.5 µSv/h.
• Auto width adjustment conveyor, flat belt transfer, safety interlocks, etc.
• Software includes self-diagnostic features and exposure dose prediction / simulation to help minimise operator / component exposure.

• Although imaging resolution is excellent, very fine features (below ~ 8-10 µm) might still push the limits, depending on detector option.
• Larger PCBs at maximum size may require multi-step capture if detector size or FOV is limited.
• The machine is large, heavy and requires substantial floor and power infrastructure; not trivial to install.
• Maintenance, calibration, and operator training are important to ensure that the increased speed and detection capability are maintained without loss of accuracy.