PDR IR-E6 BGA/SMT Rework Station XL PCBs

The PDR IR-E6 is a high-performance rework system purpose-built for precision soldering and desoldering of surface-mount devices (SMD), BGA, µBGA, CSP and other advanced packages on extra-large PCBs typically used in aerospace, automotive, telecommunications and other high reliability electronics applications.

It employs PDR’s patented Focused Infrared (IR) technology which is tool-free, gas-free and provides precise, controllable non-contact heating to rework components without damaging adjacent parts or the PCB.

This station supports large PCBs up to approximately 18 × 24 inches (460 × 620 mm), making it suitable for reworking oversized and complex assemblies.

The system combines gantry-mounted focused IR top heating and a multi-zone powerful quartz IR PCB preheater to deliver uniform thermal profiles across the board. It also includes closed-loop non-contact temperature sensing for both component and PCB control.

Yes, it integrates a split beam prism alignment system with up to 50× magnification, enabling accurate placement and alignment of components before reflow.

The IR-E6 is capable of reworking a wide variety of components, from tiny 01005 parts to BGAs, QFNs, CSPs and LEDs  while preserving board and adjacent component integrity.

The station uses PDR’s Thermoactive Software Suite for advanced process setup, thermal profile control and repeatable results suitable for integration with modern production workflows.

The PDR IR-E6 includes a 2-year warranty and carries international safety and quality certifications such as CE, UKCA and NFPA 79, reflecting its suitability for demanding industrial environments.

The PDR IR-E6 uses a closed-loop, non-contact infrared heating system that independently controls both the component and the PCB temperature. Its focused IR top heater delivers localised energy only where needed, while the multi-zone quartz IR bottom preheater evenly stabilises the entire PCB a critical requirement for large, high-thermal-mass assemblies. Integrated temperature sensors continuously monitor real-time conditions, allowing the system to automatically adjust output and maintain precise thermal profiles, ensuring repeatable, low-stress rework even on dense, multilayer XL PCBs.