Olamef TP/TO-CF – Cutting & Forming Machine for Transistor Leads

Olamef TP/TO-CF Cutting & Forming Machine is designed for automatically cutting and forming transistor leads directly from tube packaging. It prepares components such as TO-220, TO-218 and TO-126 packages for PCB assembly, ensuring consistent lead trimming and forming before board insertion or surface mounting.

The TP/TO-CF is designed for transistor packages supplied in tubes, including TO-220, TO-218 and TO-126 devices commonly used in power electronics and control circuits.

Using a dedicated transistor lead forming machine improves component consistency, reduces manual handling errors, and ensures precise lead positioning for faster and more reliable PCB assembly processes.

Olamef TP/TO-CF – Cutting & Forming Machine for Transistor Leads can process approximately 3,000 components per hour, making it suitable for electronics manufacturing environments that require efficient component preparation before PCB insertion.

Yes. The machine can perform several lead forming operations depending on the installed die set, including straight cut, 90° bending, surface mount forming, and lead spreading. Custom dies can also be produced to meet specific manufacturing requirements.

Olamef TP/TO-CF – Cutting & Forming Machine for Transistor Leads uses two wire holders to secure the leads before cutting and forming begins. This ensures precise handling and prevents damage to the component during processing.

Yes. The Olamef TP/TO-CF – Cutting & Forming Machine for Transistor Leads is designed for industrial production environments including OEM electronics manufacturing, contract electronics manufacturing (EMS), and high-volume PCB assembly lines.

Transistor cutting and forming machines are commonly used in:

• Power electronics manufacturing
• Industrial control systems
• Automotive electronics
• Consumer electronics production
• Contract electronics manufacturing (EMS)

Automated lead forming machines reduce manual labour, increase production consistency, improve PCB assembly accuracy, and minimise the risk of lead damage during processing.