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1300 36 00 31
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1300 36 00 31
The compact and robust design of the Minioven 05 is specially designed for re-balling of BGA’s and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats up the electrical components like a standard reflow oven: gently and simultaneously from all sides and guarantees repeatable process results with high yield. The Minioven 05 is ideal for use in production and R&D environments.
The large display and four button front panel layout enables fast set-up and administration of up to 25 re-balling profiles, which can be saved in the device. The MINIOVEN 05 uses readings from a second temperature sensor which is connected to the oven and attached next to the BGA to measure the IC temperature. An input for the use of process gases (such as nitrogen) is factory set.
The PC software EASYBEAM is included and can be used to download profiles, i.e. for easy back-up and upload of re-balling profiles from a production server. EASYBEAM V2 connects via USB and can also display temperature plots of the two sensors and allows optimisation of profile parameters to fit user expectations.
A wide range of tooling and accessories available for BGA and QFN pre-bumping.
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
If you’d like more information first click below.
| Power consumption: | 550 VA |
| Power heating system: | 500 W |
| Size heating system: | 105 x 130 mm2 |
| Temperature range: | 50 °C – 250 °C |
| Temperature range: Number of temperature sensors: | 1 x internally inst. & 1 x external opt. |
| Number of profiles: | 25 memory slots |
| Max. component size: | 55 x 55 x 4 mm3 |
| Mains: | 1 Phase, 230 VAC |
| Dimensions: | 150 x 300 x 85 mm3 |
| Weight: | 800 g |
| Power consumption: | 550 VA |
| Power heating system: | 500 W |
| Size heating system: | 105 x 130 mm2 |
| Temperature range: | 50 °C – 250 °C |
| Temperature range: Number of temperature sensors: | 1 x internally inst. & 1 x external opt. |
| Number of profiles: | 25 memory slots |
| Max. component size: | 55 x 55 x 4 mm3 |
| Mains: | 1 Phase, 230 VAC |
| Dimensions: | 150 x 300 x 85 mm3 |
| Weight: | 800 g |
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Hawker Richardson operates Australia and New Zealand-wide, with offices in Melbourne, Sydney, Brisbane and Adelaide.
Head Office
75-77 Westgate Drive, Altona North,
Victoria, 3025
Phone
1300 36 00 31
