The compact and robust design of the Minioven 05 is specially designed for re-balling of BGA’s and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats up the electrical components like a standard reflow oven: gently and simultaneously from all sides and guarantees repeatable process results with high yield. The Minioven 05 is ideal for use in production and R&D environments.
This product is available to view in our virtual demo.
Click to the right if you’d like to see the product in-situ within an SMT line, where you can also view a 3D file and watch a short video introduction.
If you’d like more information first click below.